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The Largest Design & Manufacturing Event in Minneapolis Partners with Leading Industry Associations

SANTA MONICA, CA - The Midwest's largest design and manufacturing event today announced its partnership with leading manufacturing, medtech, and packaging associations including Medical Alley Association, MedTech Association, Institute of Packaging Professionals (IoPP) and Minnesota Precision Manufacturing Association. The event takes place November 8-9, 2017 at the Minneapolis Convention Center. To learn more and register, please visit:

The Largest Design & Manufacturing Event in Minneapolis Partners with Leading Industry Associations
The event is made up of six co-located events that support various industries, including Automation Technology Expo (ATX), Design & Manufacturing, Embedded Systems Conference (ESC), Medical Design and Manufacturing (MD&M), MinnPack and PLASTEC.

"We are delighted to have event partners that are helping to support growth and innovation within the industries we serve," said Nina Brown, vice president of events, UBM. "We are continuing a strong relationship with Medical Alley, funding scholarships to develop the future packaging workforce with IoPP, and it's also fantastic to have a spectrum of partners that serve advanced manufacturing."

"The Medical Alley Association takes great pride in supporting businesses in Medical Alley, the global epicenter of health innovation and care, making MD&M Minneapolis an ideal partner for our organization," said Shaye Mandle, president and CEO, Medical Alley Association. "For over 22 years, MD&M Minneapolis has been a premiere gathering place for industry professionals, and we have no doubt our shared commitment to the innovation and evolution of healthcare will enhance this year's programming."

All four partners will be present in the expo hall, providing the over 5,500 in attendance with the latest information in their respective industries:
Medical Alley Association (booth 2403)—Acts as the voice of the Medical Alley Community in Minneapolis and delivers information on the medical technology industry as a whole.

The Institute of Packaging Professionals (IoPP) (booth 737)—A professional organization that serves the packaging community through networking and relationship building opportunities. The IoPP will also announce the recipients of its packaging scholarship program funded by UBM, which is awarded to select packaging schools in order to help develop local packaging education programs. The scholarship recipients will be announced on November 9, 2017 at 11:00 A.M.

MedTech Association (booth 2647)—Represents New York State's medical industry and acts as an advocate for the field
Minnesota Precision Manufacturing Association—Represents the manufacturing industry within Minnesota (and has a membership base of over 300)

Register for MD&M Minneapolis
To register for MD&M Minneapolis please visit:
To register for a media pass, please visit:
Follow us on social: Facebook, LinkedIn, Twitter, #AdvMfgExpo

Future Events:
BIOMEDevice San Jose 2017: San Jose, CA, December 6 - 7, 2017
DesignCon 2018: Santa Clara, CA, January 30 - February 1, 2018
Medical Design and Manufacturing (MD&M) West: Anaheim, CA, February 6 - 8, 2018

About Advanced Manufacturing Expos & Conferences
UBM's Advanced Manufacturing portfolio is the leading B-to-B event producer, publisher, and digital media business for the world's $3 trillion advanced, technology-based manufacturing industry. Our print and electronic products deliver trusted information to the advanced manufacturing market and leverage our proprietary 1.3 million name database to connect suppliers with buyers and purchase influencers. We produce more than 50 events and conferences in a dozen countries, connecting manufacturing professionals from around the globe. The Advanced Manufacturing portfolio is organized by UBM plc. UBM is the largest pure-play B2B Events organizer in the world. Our 3,750+ people, based in more than 20 countries, serve more than 50 different sectors. Our deep knowledge and passion for these sectors allow us to create valuable experiences which enable our customers to succeed. Please visit for the latest news and information about UBM.

SHENMAO Exhibits at IWLPC October 24 & 25, 2017 Booth # 12

San Jose, CA - SHENMAO Technology. Inc. introduces New Generation Ultra Low Residue Liquid Flux SMF-WB51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.

SHENMAO also introduces New Generation Lead-free Solder Paste PF606-P140 and Zero-Halogen Lead-free Solder Paste PF606-P245 with a wide process window, superior print and solderability to solve Head on Pillow issues and improve ICT testability, and easily fit into complicated PCB designs through excellent convergence performance.

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high-quality sphericity. Various diameters (0.76, 0.65, 0.64, 0.5, 0.45, 0.4, 0.3, 0.25, 0.2, 0.15, 0.1, 0.09, 0.08, 0.075, 0.07, 0.06, 0.055, 0.05 mm Dia. - 0.045 and 0.040 mm Dia. are in development) are available in SAC305, SAC405 and SAC1205 Alloys at affordable low cost from 10 worldwide SHENMAO locations.

As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Cored Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon. Please contact: SHENMAO America, Inc.  Tel: 408-943-1755   e-mail:

To Register:

Pillarhouse International includes improved functionality to their Handex and Synchrodex ranges: No Price Increases

Chelmsford, Essex, UK – Pillarhouse International Ltd today announced: The motorised solder feeder option will now be included, as standard, on their range of Handex and Synchrodex selective soldering systems. This option improves on the already successful pneumatic system that has been fitted for many years.

“Adding this feature to the Handex and Synchrodex range”, says David Johnson, Sales Director at Pillarhouse “shows our desire to provide the best possible solutions for our customers. It also furthers our commitment to be the world leaders in Selective Soldering technology”.

This option is also available as a retrofit upgrade for existing Handex and Synchrodex systems.

About Pillarhouse International Ltd
Pillarhouse has been a leading force in the selective soldering of today’s modern machines; offering a range of
machine options to cover the wide variety and complexity of today’s modern electronics. Our philosophy is to
produce high engineering standard products with a focus on innovation and cutting edge development.
With its Design and Manufacturing Headquarters in Chelmsford – UK; alongside supplementary Manufacturing,
Sales and Service facility in Suzhou – China; and Sales and Service support in Chicago – USA. Pillarhouse has
developed into a Global Company with Sales and Service facilities in over 50 countries.
More info at

Insight Equity Acquires VirTex Enterprises

SOUTHLAKE, Texas and AUSTIN, Texas - An affiliate of Insight Equity Holdings LLC ("Insight Equity"), the Southlake, Texas headquartered private equity firm, is pleased to announce the acquisition of VirTex Enterprises ("VirTex"), a leading vertically integrated electronic manufacturing services provider. The Company features over 165,000 square feet of manufacturing space with the ability to produce both complex electronic components and complete systems for customer platforms with volumes ranging from prototyping to full-scale production.

"VirTex combines the sophisticated processes and manufacturing capabilities of a large-scale electronic manufacturing services provider with the attention and customization of a local partner. The Company has advanced manufacturing and assembly capabilities, broad end market diversification, and a deeply experienced management team that is focused on providing the highest quality of service to its customers. We are excited to partner with the VirTex management team to continue to grow the company and further expand its manufacturing capabilities," remarked Luke Bateman, a Vice President at Insight Equity.

Brad Heath, CEO of VirTex, commented, "We have had many years of significant growth, and the partnership with Insight Equity will allow us to continue to expand without compromising the service and flexibility our customers expect from VirTex. Our management team is looking forward to augmenting VirTex's capabilities and broadening the services we offer our customers through the support and significant financial strength that this partnership provides."

Victor Vescovo, COO & Managing Partner at Insight Equity, noted, "We are enthusiastic about the future prospects for VirTex and the hi-mix, low-volume electronic assembly niche that it serves. We believe our hands-on collaborative approach and financial resources will allow us to greatly enhance the opportunities available to the firm to grow organically and acquisitively in the future."

About Virtex Enterprises
VirTex manufactures printed circuit board assemblies and other critical electronic systems for small and medium-sized customer programs across a wide range of industries, including: industrial, aerospace and defense, automotive, and medical. By providing a focused market-segment approach, VirTex is able to bring greater value and innovation to its customers, improve OEM competitiveness, and deliver comprehensive, tailored solutions that are specific to each customer. VirTex is based in Austin, Texas, with additional manufacturing facilities in Menomonee Falls, Wisconsin and Juarez, Mexico.

About Insight Equity
Insight Equity makes control investments in strategically viable, middle-market manufacturing and distribution businesses across a wide range of industries. Leveraging a proven, collaborative value creation model, Insight Equity facilitates operating enhancements and growth. The firm specializes in partnering with companies in complex or challenging situations, including corporate divestitures, management buyouts, aggressive growth opportunities, going-private transactions, restructurings, and transitions from family ownership. Insight Equity is headquartered near the Dallas / Ft. Worth International Airport in Southlake, Texas. The firm also has an office in New York City.

Ironwood Electronics Intros 293 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

EAGAN, MN - Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for Micro Controller Units - CBT-BGA-6071. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz and contact resistance is <30mOhms. The current capacity of each contactor is 4 amps at 60C temperature rise. Socket temperature range is -55C to +180C. Socket also features a floating guide for precise ball to pin alignment. The specific configuration of the package to be tested in the CBT-BGA-6071 is a BGA, 17x17mm, 0.8mm pitch, 293 position, 20x20 ball array.
The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint for nearby passive components. Socket uses 5 post stiffener plate to support back side of the PCB and allows passive components to be placed in between posts. This socket utilizes clamshell lid with integrated compression mechanism. To use, place the BGA device into the socket base and close the clamshell lid assembly on to the base using the latch. Turning the compression screw handle applies downward pressure via integrated compression plate. This socket can be used for hand test and temperature characterization as well as debugging application in development and MCU comparison between various manufacturers.

Juki Automation Systems Awards Quantum Systems ‘Representative of the Year –Best Performance’


From left to right: Carlos Eijansantos – Juki’s Sales Manager – Americas, Bill Butt – Principal, Quantum Systems, and Bill Astle – President, JAS, Inc.


MORRISVILLE, NC Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, recently presented Quantum Systems with the award for ‘Representative of the Year – Best Performance.’ Bill Astle, President of JAS, Inc., presented the award to Bill Butt of Quantum Systems at the recent awards banquet held during the Juki Americas National Sales meeting that took place at Juki’s facility in Fremont, CA.

Carlos Eijansantos, Juki’s Sales Manager – Americas, commented: “I’ve worked with Bill for a long time and he is one of our best performing reps. I am really glad that he won the ‘Best Performance Award’ this year because I know that he worked really hard in bringing new customers to Juki.”

Quantum Systems is a manufacturers’ representative organization that covers Arizona and New Mexico for JAS, Inc. The company’s primary focus includes the electronics, semiconductor, light industrial and maquila markets. Quantum Systems provides top tier suppliers with world-class representation. 

Quantum Systems represents Juki’s full line of automated assembly products and systems. For more information about Quantum Systems’ products and services, contact Bill Butt at (480) 219-4553 or visit

For more information about Juki, visit

Inventec introduces new enhanced co-solvent, Topklean EL20P for challenging defluxing applications

Vincennes, France - For almost 2 decades, the Topklean EL 20 product range from Inventec Performance Chemicals (Inventec) has been the best in class co-solvent agent to be used mixed or separated with HFEs (hydrofluoroether) in vapour phase cleaning systems to remove solder flux residues, before application of conformal coatings, underfills or wire bonding process.

The cleaning action to remove baked-on solder flux residues after reflow, also known as defluxing, from printed circuit boards and power semiconductors has become more and more challenged because of the higher densities in today’s electronics, miniaturization, lower stand off components, and complex geometries This situation becomes even more difficult in lead free assembly where higher process temperatures are applied causing charring to flux residues.

The Topklean EL20P is the newest product in the range, it has been designed in response to the latest defluxing needs, formulated to have an outstanding capillary action by taking into consideration two main parameters: the penetration coefficient and the solvency power, it has a lower surface tension compared to other co-solvent agents in the market. The high wetting performance of Topklean EL20P allows to efficiently clean lead free fluxes after reflow which are hard to remove. Miniaturization and advanced packaging should not become a challenge for reliability anymore.

The main benefits offered by Topklean EL20P are:

  • Enhanced solvency power to dissolve and remove Lead Free flux residues
  • Faster cycle time due to its higher solvency and rinsing capabilities
  • Lower ionic contamination
  • Improved environmental performance. It is not toxic, it has a very low environmental impact and its formulation includes a high percentage of renewable raw materials.
  • Great materials compatibility including labels placed on PCBA before cleaning process.
  • Fully compatible with main vapour phase cleaning systems available in the market

Topklean EL20P is available worldwide in 20 l and 200 l drum containers.

Inventec presents its new products at productronica 2017, hall A1, booth 417

For more information on Inventec Performance Chemicals products and services please go to or follow @Inventec_BUEL on Twitter.