Click here to see the raw Rss Data or view with browser Rss viewer. - Home/Current Issue


Sonobond’s Ultrasonic Technology Meets ABYC Standards for Electrical Systems in Marine Applications

WEST CHESTER, PA - Marine motors present especially demanding conditions for electrical systems. Constantly exposed to high-humidity, their performance relies on the protective properties of tin-coated copper wiring.

Indium Corporation Offers One-Source Solution for High-Purity Tin (Sn) Metal Applications

CLINTON, NY - Indium Corporation delivers a single-source solution, from mine to packaging, for high-purity tin materials. The company offers tin in a number of physical forms and purity levels of up to 5N or 99.999%-pure.

New Nordson YESTECH Investment Takes MC Assembly’s Quality Inspection Capabilities to the Next Dimension

MELBOURNE, FL - MC Assembly, a leading mid-tier electronics manufacturing services provider, recently enhanced its inspection capabilities by purchasing and installing a Nordson YESTECH’s FX940 ULTRA 3D Automated Optical Inspection (AOI) machine.


Pelham, NY – Pico Electronics, a leading manufacturer of ultra-miniature and miniature Transformers, Inductors, DC-DC Converters, and AC-DC Power Supplies, announced today the launch of its updated website,  The new user-friendly “self-serve” website offers design engineers immediate access to Pico’s extensive product line through a powerful new search tool. 

D3 Semiconductor Superjunction +FETs™ Push Performance Envelope

ADDISON, TX - D3 Semiconductor, a company bringing together affiliated semiconductor companies and top-talent experts, announces its inaugural entry into the power semiconductor market with the launch of its +FET™ line of 650V-rated superjunction MOSFETs.

Debut at SMT Hybrid & Packaging 2017: Complete line solution with E by SIPLACE and E by DEK

The E by SIPLACE and E by DEK modules can be combined to form powerful line solutions that offer additional benefits.

MUNICH, GERMANY - After the successful rollout of the E by SIPLACE placement solution, ASM Assembly Systems is now following up with the E by DEK. Like the E by SIPLACE before, the new printing platform for mid-speed applications, high mix and prototype productions sets totally new standards in terms of quality, performance and modularity with core cycle times of 7.5 seconds incl. print and a repeat accuracy rating of ±12.5 µm @ 6 Sigma.

Avnet Names Lou Lutostanski as Vice President, Internet of Things


PHOENIX, AZ —Avnet, a leading global technology distributor, today announced the promotion of Lou Lutostanski to the role of vice president of Internet of Things (IoT), effective immediately. Lutostanski will report directly to Pete Bartolotta, chief transformation officer for Avnet. In his new role, Lutostanski will strengthen Avnet’s IoT strategy and further Avnet’s reach to makers, entrepreneurs, startups and other IoT innovators, enabling them to bring their IoT solutions to market, from idea to production.

New IDT Inductive Position Sensor Family Improves Reliability and Flexibility While Reducing System Costs

SAN JOSE, CA - Integrated Device Technology, Inc. (IDT) today introduced a new family of high-performance inductive position sensors offering superior reliability, flexibility and serviceability while cutting system costs. The three ZMID520x sensors are automotive qualified to the AEC-Q100 standard and support implementation in safety-related systems compliant to ISO26262 up to ASIL-B.

Fujipoly's Form-in-Place TIM Fills Large Gap

Carteret, NJ SARCON® SPG-30B from Fujipoly® is a new form-in-place thermal gap filler that eliminates performance-hindering air gaps ranging from .08mm to 1.0mm. SPG-30B delivers a superior thermal conductivity of 3.1 W/m°K with a thermal resistance of only 0.33°Cin2/W.