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U.S. Tech Publisher’s Choice: December 2018

The first computer link using optical fibers was commissioned four decades ago to safeguard communications from electromagnetic interference at the Cheyenne Mountain U.S. Air Force strategic command center in Colorado Springs, Colorado. In an article titled “Automating Photonic Alignment Addresses Silicon Photonics Production Bottleneck,” Scott Jordan, senior director of NanoAutomation technologies and head of photonics at PI (Physik Instrumente) discusses the broad adoption of photonic communications technologies in an unfolding pattern of consistently diminishing physical size.

Photonic communications are now used as a replacement for costly and laggy satellite links for transoceanic telecommunications; as the backbone of transcontinental communications — first for voice landlines and later for data; as the foundation for regional and metropolitan communications infrastructures; and as a delivery mechanism for bandwidth to businesses and consumers.

Photonics are used in scalable and high-capacity mechanisms for data links across and between data centers, from rack-to-rack, from box-to-box, and soon from chip-to-chip.

This excerpt is from “Automating Photonic Alignment Addresses Silicon Photonics Production Bottleneck" and was originally published in the October 2018 issue of U.S. Tech.

ITW EAE - Electrovert(R) introduces new DwellFlex™ 4.0 Variable Contact Wave Solder Nozzle

CAMDENTON, MO - As PCB manufacturers continue to implement automation into high-mix environments, ensuring the wave soldering process has maximum performance flexibility is critical. To meet that challenge, Electrovert is introducing the DwellFlex 4.0 variable contact wave solder nozzle.

The DwellFlex 4.0 is the first nozzle designed specifically with Industry 4.0 automation in mind. The patent-pending design enables the wave width to be adjusted on-the-fly as variable board types are run through the wave. This ensures solder contact time is optimized for a high-mix of board types without changing conveyor speeds.

“Optimizing the length of time the PCB is in contact with the wave maximizes the potential for topside hole-fill without introducing copper dissolution,” said Greg Calvo, Electrovert Product Manager. “The DwellFlex 4.0 allows manufacturers to make machine parameter changes on-the-fly without disrupting or slowing down production.”

The DwellFlex 4.0 provides the highest level of soldering capability for thermally challenging and difficult to solder applications. At full-width it delivers the most thermal energy and longest dwell time capability in the industry. The DwellFlex 4.0 is flexible enough to meet high-mix requirements of today’s board designs and technologies and is ready for the smart factories of the future.

Electrovert will be conducting demos of the DwellFlex 4.0 variable contact wave solder nozzle at ITW EAE’s APEX, booth # 3339 January 29-31 in San Diego.

O.C. White Co. Appoints Quality Associates Reps for Michigan

THORNDIKE, MA - O.C. White, the world’s oldest and most respected industrial lighting- and inspection manufacturer, announces the appointment of Quality Associates (QA Rep), a Michigan based Manufacturer’s Rep agency serving the electronics industry in the Michigan and Ohio markets. Quality Associates began representing O.C. White products in Michigan effective since December 1, 2018.

Steven Neumaier and Brad Kendall represent O.C. White selling a wide range of products ranging from illuminated magnifiers to microscopes, machine lights, task lighting, and much more. With more than 30 years’ experience in the industry, Steve and Brad are technical experts who are ready to support O.C. White’s existing and new potential customers.

Quality Associates is project focused, engineering focused and consultative focused. With the extremely strong capital equipment focus and with a very well-established connection in the distribution world that Kendall brings to the company, Quality Associates offers a complete package to its clients and principals alike. For more information about Quality Associates, email  or visit

About O.C. White
The O.C. White Company is the world’s leading designer and manufacturer of industry-specific lighting and inspection products since 1883. O.C. White’s 135-year history of quality and innovation has seen its technology adopted by the biggest names in electronics and aerospace industries as their go-to inspection provider for mission-critical applications. For more information, Contact the O.C. White company at 4226 Church Street, Thorndike, MA 01079, Phone: (413) 289-1751, Fax: (413) 289-1754,, and visit

There are just 3 days left to get a 20% discount to the IPC’s Executive Forum on Advancing Automotive Electronics at IPC APEX EXPO 2019 in San Diego January 28.

This not-to-be-missed event covers developing specialty chemicals and materials for PCB fabrication and assembly, reliability testing, software, future needs, and the creation of America’s first 4.0 green fabrication facility.

Presentations include: “Enabling Connected, Electrified and Automated Mobility: Challenges for Assembly and Interconnect Technology”, by the noted Dr. Udo Welzel, Team Leader for Assembly and Interconnect Technology Integration for High-Performance Logic Automotive Electronic Control Units of Robert Bosch GmbH, and “Integrated Intelligent Transportation and Key Enablers”, by Dwight Howard, Manager, Electrical Engineering, North America & Asia-Pacific Product Development Infotainment and Driver Information (IDI) PBU, Electronics & Safety Division, APTIV LLC

Registration information for the Executive Forum on Advancing Automotive Electronics is available online at 

Register NOW to claim your 20% discount!

For further information contact forum chairman Gene Weiner at or Tracy Riggan, Senior Director, Member Support at

TRI Highlights Smart Factory Inspection Solutions at IPC APEX EXPO 2019

SAN JOSE, CA - Test Research, Inc. (TRI) will join IPC APEX EXPO 2019 held at San Diego Convention Center to showcase its Smart Factory inspection and test solutions for the printed circuit board electronics manufacturing industry. Visit TRI at booth #2533 on January 29 – January 31, 2019 to discover the newest innovations in 3D SPI, 3D AOI, 3D CT AXI and multicore ICT.

TRI is celebrating its 30th anniversary as the leading test and inspection solutions provider for the electronics manufacturing industry. TRI will proudly be displaying a commemorative 30th anniversary logo at IPC APEX EXPO 2019. TRI’s VP of Sales and Marketing, Jim Lin noted “We are grateful to our clients for the opportunities to provide them with solutions. We will continue providing innovative solutions as the leader in inspection and test in the SMT industry.”

TRI’s 2019 lineup features the industry’s leading 3D SPI TR7007QI, for accurate shadow-free solder inspection with digital fringe projectors and smart board warpage control. TRI will also exhibit the industry leading 3D AOI TR7500QE offering top and side camera multi-angle high-accuracy Inspection.

Also being showcased, TRI's new cutting-edge Inline 3D AOI TR7700Q with unprecedented 1um High-Resolution inspection capability. Discover TRI's world-class high-resolution and high speed 3D CT AXI TR7600F3D and TR7600 SIII. Finally complete your SMT Inspection and test tour with TRI's multi-core ICT TR5001Q SII Inline.

Visit us at IPC APEX EXPO 2019 booth #2533 for a personal demonstration of TRI's industry leading world-class test and inspection solutions lineup

About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), Functional Testers (FCT) and In-Circuit Testers (ICT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements. Learn more at For sales and service information, write us at or call +1 (408) 567-9898.

Acculogic Appoints New Rep Firm to Expand Support in the Southwest

MARKHAM, ON - Acculogic Inc., a global leader in electronic production test solutions is pleased to announce the appointment of Southwest Systems Technology, Inc. as its representative in the state of Texas.

Southwest Systems Technology was founded in 1989 with offices in Texas and Mexico, serving the electronic and semiconductor manufacturing industries. The company sells capital equipment, benchtop tools and manufacturing consumables, and its sales engineers are trained in the latest industry processes and technologies.

“I really enjoyed being an Acculogic customer at ACD, and I look forward to working with them again,” stated Scott Fillebrown, Managing Director at Southwest Systems Technology. “I believe they have the best test platform in the industry.”

Karim Dhekordi, General Manager of Acculogic, said, “Southwest’s industry and product knowledge will complement our expanding business. By working together, we can continue to increase our market share in the Southwest region. Clients will benefit from the capabilities of Scott and his team, to gain a deep and complete understanding of their requirements and present them with the right solutions to achieve their desired results.”

Acculogic’s flagship products, the FLS980 Flying Probe tester, the iCT7000 In-circuit tester, the BRiZ Automated Test & Programming Stations, and the ScanNavigator Boundary Scan test suite, help ensure that tomorrow’s technologies do not outpace today’s test capabilities. These products are highly advanced, scalable solutions made to solve a wide range of test challenges.

For more information about Southwest Systems Technology, contact Scott Fillebrown at or visit

For more information about Acculogic, visit

About Acculogic Inc.
Acculogic is a global supplier of automatic test equipment and application support services. Acculogic's test products include the Flying Scorpion - world’s only double sided Flying Probe with 3-D joy-stick-like probe motion and 22 probes , an extensive line of bed-of-nails In-Circuit Test Systems, a powerful suite of Boundary Scan test and programming tools, and Application Specific PXI/LXI based Functional Test Systems. Acculogic systems are used by manufacturers of electronic devices and circuit assemblies. Acculogic is a private, growing and profitable company with operations in United States, Canada, Mexico, Germany, France, Japan and an extensive network of sales and supports centers around the world. For more information about Acculogic, visit

TopLine Low-cost Zero Ohm SOT23 Jumpers Eliminate PCB Redesign Headaches

IRVINE, CA - TopLine offers near zero-ohm SOT23 Jumper components, a low-cost way to short out Printed Circuit Board circuitry (PCB) without the need to redesign or spin a whole new board. TopLine jumper components are available in a variety of component outlines and connect (short-out) specific pins together with less than 50 milli-ohms resistance.

“Jumpers are a quick and easy way to replace unneeded circuits,” states Martin Hart, TopLine’s President. “For example, our SOT23 Jumpers mount on the PC Board using normal SAC305 lead-free solder paste, just like regular components.”

TopLine offers all popular configurations. For example, Pin 1 is shorted to Pin 3. Another configuration shorts Pin 2 to Pin 3. TopLine also makes a version with Pin 1, Pin 2 and Pin 3 all shorted together.

TopLine's series of SOT23 Jumpers withstand 75VDC at 100mA with 350mW power dissipation. Their operating temperature ranges from -65⁰C to +150⁰C. Standard and halogen-free versions are available. Other versions with up to 8 shorted pins are available. For more information, visit .

About TopLine
TopLine manufactures a wide range of jumper semiconductor packages for jumpering PC boards. TopLine provides technical assistance for customized jumpers and PC Board jumpers. TopLine is a one-stop source for all jumper, spacers and isolated space-filler components. Contact TopLine Corporation, Tel (800) 776-9888; Email:

Würth Elektronik eiSos to build technology center in Munich

WALDENBURG/MUNICH, GERMANY - Würth Elektronik eiSos is investing a nine-figure sum in its “HIC – High-Tech Innovation Center” that is due to begin operations by 2020, in Munich-Freiham. The new site of the electronic and electromechanical components manufacturer will be a hub for developing new technologies and products. It spans 8,082 m² of land and will accommodate 13,700 m² of office and lab space. Würth Elektronik eiSos will be creating many skilled jobs at the HIC, with at least 500 employees developing and conducting research there in future.

“Despite having rented additional space for and at our current Design Center Garching near Munich, we still need more room. We therefore decided to build a new facility and consolidate our development expertise in Freiham,” explains Oliver Konz, CEO Würth Elektronik eiSos. Thomas Schrott, also CEO Würth Elektronik eiSos, adds: “With the HIC we will be expanding our activities in the Munich metropolitan area and creating a global R&D center and highly attractive workplace for electronics specialists from different countries and cultures who want to actively shape future technologies.”

A place for innovations
“We give our customers immense application support to make sure that our products are absolutely fit for purpose. This investment will pave the way for a significant expansion of the research departments at the Munich High-Tech Innovation Center,” comments Alexander Gerfer, CEO Würth Elektronik eiSos.

Oliver Opitz, Site Manager and Vice President, adds: “It is a key priority for us to promote interdisciplinary communication and interconnect the specific competencies of all the Würth Elektronik eiSos departments. And we want our customers and development partners to benefit from this close cooperation. We are creating the future!”

About Würth Elektronik eiSos
Würth Elektronik eiSos GmbH & Co. KG is a manufacturer of electronic and electromechanical components for the electronics industry. In 2017, the company employed 6 700 people. Würth Elektronik eiSos is one of the largest European manufacturers of passive components and is active in 50 countries. Production sites in Europe, Asia and North America supply a growing number of customers worldwide.

The product range includes EMC components, inductors, transformers, RF components, varistors, capacitors, resistors, quartz crystals, oscillators, power modules, Wireless Power Transfer, LEDs, sensors, connectors, power supply elements, switches, push-buttons, connection technology, fuse holders and solutions for wireless data transmission.

Through its technology partnership with the Audi Sport ABT Schaeffler Formula E Team and its support for the Formula E racing series, the company demonstrates its innovative strength in eMobility (

Further information at

Siemens Digital Logistics merges with LOCOM

The corporate merger of Siemens Digital Logistics GmbH, LOCOM Software GmbH and LOCOM Consulting GmbH was successfully completed on December 14, 2018. Effective immediately, these consolidated companies are operating under the brand name Siemens Digital Logistics, which is the legal successor firm of the former LOCOM companies. The merger applies retroactively as of October 1, 2018. As proven expert offering total, end-to-end software solutions and consulting for supply chain management, Siemens Digital Logistics profits from decades of experience in the field of logistics digitalization and supports customer efforts to optimize their processes by enhancing transparency and efficiency. The goal of the merger is to become one of the leading providers of innovative digitalization and consulting services in the logistics sector, and to contribute decisively to shaping the future of the logistics industry with progressive ideas.

The managing directors of the new firm are Holger Schmitt (CEO), Christopher Christian (CFO), and the former CEO of LOCOM, Christian Schmidt (CTO). The company’s locations in Frankenthal and Karlsruhe (Germany) and Wroclaw (Poland) are to be further expanded.

This merger will enable customers, including well-known companies in industry and trade as well as in logistics service-provider sector, to benefit from a new, strategically Siemens Postal, Parcel & Airport Logistics Press expanded solution portfolio featuring comprehensive, end-to-end coverage of the complete supply chain – ranging from consulting and both strategic and tactical planning to transparent and reliable management of supply chains and global logistics networks.

This consolidated portfolio comprises not only custom-tailored consulting services, but also innovative IT solutions for reliably and effectively controlling cross-industry logistics networks, such as the Supply Chain Suite IT platform and the cloud-based logistics platform AX4. Applying the digital twin approach enables planners to analyze complex logistics tasks based on real data, simulate solution approaches, and optimize processes iteratively. By combining multiple software products, it’s possible for example to configure and operate digital control tower solutions for various logistical scenarios.

The company formerly called AXIT GmbH, under Siemens Group ownership already since 2015, began doing business as Siemens Digital Logistics as of October 2018. With this recent fusion, SPPAL has bundled and broadened its range of offerings for holistic management of value-adding networks and supply chains. The merger underscores the ongoing strategic advancement of Siemens’ portfolio and the company’s long-term vision of expanding its market position for consulting and IT services aimed at the logistics sector.

Siemens Postal, Parcel & Airport Logistics GmbH (SPPAL) headquartered in Constance, Germany, is a fully owned subsidiary of Siemens AG. SPPAL is a leading provider of innovative products and solutions in mail and parcel logistics and automation as well as in airport logistics with baggage and cargo handling. Software solutions and customer services along the whole product life cycle complete the portfolio. The company has an installed base in more than 60 countries worldwide. Major customers include renowned airports as well as postal and parcel service providers around the globe. Further information is available on the Internet at:

Siemens AG (Berlin and Munich) is a global technology powerhouse that has stood for engineering excellence, innovation, quality, reliability and internationality for more than 170 years. The company is active around the globe, focusing on the areas of electrification, automation and digitalization. One of the largest producers of energy-efficient, resource-saving technologies, Siemens is a leading supplier of efficient power generation and power transmission solutions and a pioneer in infrastructure solutions as well as automation, drive and software solutions for industry. With its publicly listed subsidiary Siemens Healthineers AG, the company is also a leading provider of medical imaging equipment – such as computed tomography and magnetic resonance imaging systems – and a leader in laboratory diagnostics as well as clinical IT. In fiscal 2018, which ended on September 30, 2018, Siemens generated revenue of €83.0 billion and net income of €6.1 billion. At the end of September 2018, the company had around 379,000 employees worldwide. Further information is available on the Internet at

International Automotive Electronics Technology Expo 2019: WACKER and Fuji Polymer Industries Announce Close Collaboration on Silicone- Based Thermal Interface Materials

MUNICH/NAGOYA - Munich-based chemical group WACKER and Japan-based Fuji Polymer Industries announced to intensify their collaborative work on the development of innovative thermal interface materials today. To this end, Fuji Polymer Industries, a leading Japanese manufacturer of silicone rubber products, will use WACKER’s room-temperature-curing ELASTOSIL® silicones for manufacturing novel silicone-based heat-conducting components. The companies will closely collaborate on developing high-efficiency thermal interface products for electronic devices and for batteries in electric vehicles. Components based on ELASTOSIL® will be presented at the 11th International Automotive Electronics Technology Expo 2019 in Tokyo, Japan, which starts on January 16.

WACKER and Fuji Polymer Industries are leading manufacturers in the field of silicone-based thermal interface materials (TIM) for industrial applications, but have different product offerings. Whereas WACKER, as a silicones producer, supplies non-crosslinked pastelike silicones in the form of gels, adhesives, sealants or encapsulants for liquid metering, Fuji Polymer Industries produces ready-to-use silicone elastomer parts, such as contact mats, films and pads, for electronics and automotive component manufacturers.

Fuji Polymer Industries and WACKER will now intensify and broaden their collaboration. “Both companies are experts and possess unique knowledge, how to formulate and process thermally conductive silicones: WACKER in the field of liquid systems, Fuji Polymer in ready-to-use components,” says Christian Gimber, head of Engineering Silicones at WACKER SILICONES. “In future, we will intensify our collaboration in order to be able to develop innovative materials that meet the constantly growing demands of the electronics and automotive industries. The collaboration we have now embarked on will go far beyond this expo.”

At the upcoming 11th International Automotive Electronics Technology Expo in Tokyo, Fuji Polymer Industries will already exhibit the first fruits of this collaboration. “Electronic devices and batteries generate a great deal of heat that impacts their functionality and service life and can lead to serious faults. Efficient thermal management is therefore increasingly essential in many applications, such as in consumer electronics and electric vehicles,” says Gimber. For improved thermal management of components, the industry is increasingly turning to heat-dissipation materials, continues the WACKER manager. “Our thermally conductive silicones can be processed very efficiently, but that is not the only benefit of silicones. They also meet the stringent and rising safety and reliability requirements imposed by the electronics and automotive industries.”

Fuji Polymer Industries, too, will benefit enormously from the development partnership. “We have been very much looking forward to this collaboration which is very important for us. WACKER’s technical expertise is an invaluable resource and is extremely helpful when developing new products,” says board member Mitsuhiro Fujimoto. Fuji Polymer Industries will also use WACKER’s “Based on ELASTOSIL®” logo for branding its high end silicone based thermal interface materials. “This co-branding is another significant benefit for the company in terms of quality awareness,“ emphasizes Fujimoto. “The partnership with WACKER is therefore a genuine win-win situation for us and fills us with a great deal of pride.”

WACKER ( is a globally active chemical company headquartered in Munich, Germany. Its products are required in countless high-growth end-user sectors, such as photovoltaics, electronics, pharmaceuticals and household/personal-care products. In 2017, the Group generated sales of some € 4.92 billion. WACKER currently employs around 13,800 workers. Founded in 1914, the Group currently operates 23 production sites, supplying over 3,200 products to more than 3,500 customers worldwide.

The Group’s WACKER SILICONES business division is one of the largest silicone manufacturers worldwide with over 2,800 highly specialized and innovative products. The division’s portfolio ranges from silicone fluids, emulsions, resins, elastomers and sealants to silanes, silane-terminated polymers and pyrogenic silica. These stand out due to their significant value-adding potential – enhancing both the benefits and performance of customers’ end products. WACKER SILICONES’ products find application in such sectors as automotive engineering, construction, chemicals, cosmetics, medical technology, energy and electronics, and paper and textiles.

Fuji Polymer Industries
Fuji Polymer Industries is leading in the design, formulation and production of high performance thermal interface materials, electrical elastomeric connectors, customized silicone extrusions and uniquely fabricated silicone products for the electrical, electronics and automotive industries. The company’s product portfolio includes electrical connector systems, light guide elements, extruded and press-molded parts, as well as thermally conductive materials made from silicone. Headquartered in Nagoya, Japan, the company employs some 700 workers and operates a global network of nine manufacturing and distribution centers, catering to customers in the USA, in Europe and in Asia.