Monday, October 23, 2017
VOLUME -27 NUMBER 7
Publication Date: 07/1/2012
Advertisements

Archive >  July 2012 Issue >  Front Page News > 
SMTA China Names Megan Wendling Councilor of the Year

Shanghai, China — Megan Wendling, president of MW Associates, a global all-electronics marketing and electronics assembly consultancy agency, was presented with the Councilor of the Year Award by SMTA China for the sixth consecutive year. The award was received during SMTA China's annual ...
Read More
Constant Expansion at Saline


At 110,000-ft.2, the very large static-controlled manufacturing floor at Saline Lectronics is constantly humming, and has recently been upgraded by the addition of new equipment from Juki.
Read More
New IPC Survey to Measure On-Shoring in the Electronics Industry

Bannockburn, IL — IPC — Association Connecting Electronics Industries® has launched a survey to measure the impact of a phenomenon known as "on-shoring" — the migration of manufacturing operations back to the Americas from overseas, in the electronics industry. Read More
IPC Board Chairman Urges Changes to SEC Rule Proposal

Washington, DC — Steve Pudles, Chairman of the Board of IPC — Association Connecting Electronics Industries®, recently testified before Congress to urge common-sense changes to the U.S. Securities and Exchange Commission (SEC) proposed rule on conflict minerals. IPC is advocating changes to the draft SEC ...Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
search login