Thursday, May 24, 2018
VOLUME -27 NUMBER 8
Publication Date: 08/1/2012
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Archive >  August 2012 Issue >  Front Page News > 
Onshoring Momentum Powers Siplace Expansion

Atlanta, GA — The message was loud and clear at a recent ribbon-cutting and seminar in Suwanee, Georgia: manufacturing in the U.S. is having a marked resurgence, and Siplace is going to be a major contributor to this growth with its cutting-edge automated assembly equipment.
 
Siplace had been a Siemens company for many years, but the ownership changed hands in January, 2011 when Siplace was purchased by ASM Pacific Technology, a Hong Kong-based company. At the time, there was concern that a change in ownership would bring nothing but cutbacks and problems.
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Training Joystick Aviators


We are in the midst of a sea change in how military and flight simulation tools are developed, as commercial off the shelf (COTS) systems begin to replace expensive, custom-designed training simulators. Fueled by a drive to remove American service personnel from harm's way — as well ...
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IPC & JPCA Develop First Operational-Level Standard

Bannockburn, IL — In a joint effort, IPC — Association Connecting Electronics Industries® and JPCA (Japan Electronics Packaging and Circuits Association) have released the first operational-level standard for the rapidly evolving printed electronics industry. To help designers and companies create reliable ...Read More


 
 
Indium Corporation Expert to Present at PCIM Europe
CLINTON, NY - Indium Corporation expert, Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present at PCIM Europe on Wednesday, June 6, in Nuremberg, Germany.

Vijay will present Improve Reliability and Bondline Control with InFORMS® and Indalloy®276.
 

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
 
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