Thursday, May 24, 2018
VOLUME -27 NUMBER 9
Publication Date: 09/1/2012
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Archive >  September 2012 Issue >  Front Page News > 
U.S. Mfg. Market Attracts Trans-Tec and Yamaha

Chandler, AZ — Start with an American businessman setting up shop in Singapore, with his goal to provide the best possible sales and service of electronic manufacturing machinery to OEMs and contract manufacturers in Southeast Asia. Couple his expertise and drive with a partnership with a large Japanese ...
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IPC Releases On-Shoring Impact Study

Bannockburn, IL — Electronics manufacturing operations with a total value of at least $2.5 billion are expected to be brought to North America in the next three years, according to a much-anticipated new study, "On-Shoring in the Electronics Industry: Trends and Outlook for North America," published by IPC ... Read More
Electronic Product Packaging Guide Update

Arlington, VA — The Consumer Electronics Association (CEA)®, DIGITALEUROPE, and the Japanese Green Procurement Survey Standardization Initiative (JGPSSI) have released a guide for the supply chain disclosure of substances used in packaging for the global sale and distribution of electronic products.\par ...Read More
Protecting Banks and Customers with Layered Protection

Boston, MA — State Bank and Trust Company reportedly has experienced zero incidents of account takeover fraud since it deployed "Trusteer Pinpoint" and "Trusteer Rapport for Online Banking" to protect its commercial and retail customers from financial malware. According to State Bank and Trust, Trusteer was ...Read More
Baldrige Program After 25 Years

Gaithersburg, MD — Not many 25-year-olds can boast that in their short lifetime they have helped thousands of organizations develop and maintain world-class operations, innovative management, efficient procedures, involved workforces and highly satisfied customers. But one certainly can: the Baldrige Performance ...Read More


 
 
Indium Corporation Expert to Present at PCIM Europe
CLINTON, NY - Indium Corporation expert, Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present at PCIM Europe on Wednesday, June 6, in Nuremberg, Germany.

Vijay will present Improve Reliability and Bondline Control with InFORMS® and Indalloy®276.
 

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 
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