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VisionMaster to Debut M500 Manual 3-D SPI Unit in the TRC Booth at SMTA International
PORTLAND, ME ―
VisionMaster, Inc., a leading manufacturer of advanced 3-D solder paste inspection (SPI) and measurement equipment, will debut the M500 Manual 3-D SPI system in Distributor Technical Resources Corporation, Inc.’s
, at the upcoming SMTA International Conference and Expo, scheduled to take place October 16-17, 2012 at the Walt Disney World Dolphin Hotel in Orlando, FL.
With the most advanced VisionMaster software to date, the M500 makes full use of modern multi-core processors and available GPU (video card) massive parallelism to speed up processing and user-responsiveness. The M500 runs with a single click, automatically recognizing and measuring solder paste in the camera’s view. Height and volume readings for each pad are clearly displayed. Just as easily, double-clicking readings add them to the built-in SPC charts. Long life, solid state LEDs are used for projection and background lighting. Additionally, advanced CMOS image sensors are immune to electrical analog noise resulting in very repeatable measurements.
Like all other VisionMaster equipment, the M500 uses advanced white light Moiré interferometry to build height data for every pixel in the view at a fraction of the cost of the competition. VisionMaster honed this technology for SPI use and is the only manufacturer in the world deploying this sophisticated 3-D algorithm for manual benchtop units.
The M500 requires zero maintenance and is designed to provide years of trouble-free usage. Rugged yet light and portable, the sensor is machined from aircraft grade aluminum and is mounted on a vibration damping, ESD resistant granite base. To ensure consistent high quality, more than 95 percent of components are sourced in the U.S.
For more information about VisionMaster’s M500 Manual 3-D SPI system, meet company representatives in the Technical Resources Corporation
at the show or visit
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