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ACD to Exhibit World-Class PoP Assembly and Test Services at the IPC APEX EXPO
RICHARDSON, TX ―   ACD’s assembly business model is geared towards supporting high-mix, high-technology assembly from prototypes through low-to-mid volume production
ACD, a leading supplier to the electronics industry and a leader in Package-on-Package (PoP) assembly, will exhibit in Booth #817 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California.

ACD’s assembly business model is geared towards supporting high-mix, high-technology assembly from prototypes through low-to-mid volume production. With a focus on high-end technology, ACD is staffed with two shifts to respond to a variety of products, markets, and deliveries. For more than 28 years ACD has supported the printed circuit board (PCB) industry in a variety of ways; from design to laser photoplotting, to supporting engineering software, to final test. ACD offers the support required to get products to market as quickly as possible.

ACD’s functional testing verifies that each of the various product capabilities defined in the design specification or test specification meet customer requirements. In addition to flying probe test, functional test is instrumental to providing ACD’s customers with quality, defect free assemblies. ACD works closely with its customers and the Functional Test Department to develop an accurate test for each assembly.

With its medium to high-volume Juki lines, ACD averages 1.5 turns per day. The Juki lines also have this capability, and this flexibility allows ACD to process complex builds, including PoP, back-to-back with very little down time. On the MYDATA lines, the company usually completes up to four turns per day because these lines perform prototypes or small batch runs.

For more information about ACD’s design and contract assembly services, or the company’s world-class quality management system, meet company representatives at the IPC APEX Expo or visit www.ACDUSA.com.

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