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Tuesday, May 22, 2018
VOLUME - NUMBER
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measurement
Product Preview: NEPCON China
March 2013 Issue
Front Page News
March '13: Juki Celebrates 75 Years of Global Innovation and Quality
By Geron Ryden, Director of Marketing, Juki Automation Systems, Inc.
Juki Corporation was founded in December 1938 when approximately 900 machinery manufacturers in Tokyo invested in the corporation and commenced operation under the corporate name: "TOKYO JUKI MANUFACTURERS ASSOCIATION." Juki focused on sewing machine technology as well as surface ...
World's Largest Fiber Optic Network at Sandia
Albuquerque, NM — Sandia National Laboratories has become a pioneer in large-scale passive optical networks, building the largest fiber optical local area network in the world. The network pulls together 265 buildings and 13,000 computer network ports and brings high-speed communication to some of ...
New Board-Level Photonics Materials
San Francisco, CA — A major step in photonics, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers has been jointly unveiled by Dow Corning and IBM scientists. The new silicone-based material offers better physical properties ...
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY -
is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.
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