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Archive >  March 2013 Issue >  Front Page News > 

March '13: Juki Celebrates 75 Years of Global Innovation and Quality


Juki Corporation was founded in December 1938 when approximately 900 machinery manufacturers in Tokyo invested in the corporation and commenced operation under the corporate name: "TOKYO JUKI MANUFACTURERS ASSOCIATION." Juki focused on sewing machine technology as well as surface ...

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World's Largest Fiber Optic Network at Sandia

Albuquerque, NM — Sandia National Laboratories has become a pioneer in large-scale passive optical networks, building the largest fiber optical local area network in the world. The network pulls together 265 buildings and 13,000 computer network ports and brings high-speed communication to some of ...
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New Board-Level Photonics Materials

San Francisco, CA — A major step in photonics, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers has been jointly unveiled by Dow Corning and IBM scientists. The new silicone-based material offers better physical properties ...

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European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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