Monday, May 30, 2016
HOME / CURRENT ISSUE >  Product Previews >  NEPCON China Product Preview '13 > 
Agilent Technologies' Wireless Communications Test Set with Integrated Multiport Adapter
Publication Date: 3/12/2013

Santa Clara, CA — Agilent Technologies Inc. (NYSE:A) introduced its new E6607C EXT wireless communications test set, featuring an integrated multiport adapter for cost-effective, high-volume wireless device manufacturing test. Optimized for testing multiple devices simultaneously, the EXT-C with ...
ECD SensorWATCH Factory-Wide Humidity Monitoring System Mitigates MSD and ESD Risk
Publication Date: 3/12/2013

Milwaukie, OR — ECD launches its latest product to reduce the risk of MSD- and ESD-related defects. The new system, called SensorWATCH, is said to be the first factory-wide humidity and temperature monitoring system that provides customer audit protection, delivers 24/7/365 access to factory ...
Machine Vision Products Introduces Two AOI Systems
Publication Date: 3/12/2013

Carlsbad, CA— Machine Vision Products (MVP) recently introduced two new Selecta and SupraE automated optical inspection (AOI) systems. The Selecta (AOI) platform is dedicated to the selective solder and wave solder processes. Based on MVP's SMT AOI system, the Selecta is a look-up system where imaging ...
MicroCare Corporation Introduces VOC-Free Flux Remover
Publication Date: 3/12/2013

New Britain, CT — MicroCare Corporation has launched its newest VOC-exempt formula, VOC-free flux remover UltraClean, a non-chlorinated, halogen-free cleaning fluid. UltraClean is formulated to remove rosin, OA, synthetic, and no-clean fluxes, as well as hard-to-clean solder pastes used in the ...
Omron Showcases Advanced 3D SPI, AOI, and AXI
Publication Date: 3/12/2013

SCHAUMBURG, IL — Omron Inspection Systems displayed its new VT-S500 3D Post-Reflow machine and VT-X700 In-Line Automated X-Ray Inspection System at IPC APEX 2013. Using 3D image processing, the high speed VT-S500 analyzes topographical features of solder fillets, performing inspections that closely mimic IPC ...
Techcon Systems TS9200D Series Jet Tech Valve
Publication Date: 3/12/2013

Garden Grove, CA — Techcon Systems, a product group of OK International, will release its TS9200D Series Jet Tech valve with a new diaphragm design. A single, easily replaceable diaphragm eliminates dynamic fluid seals. You do not have to disassemble, clean and replace worn seals, saving time and ...
Viscom XM Camera Module for Extreme Cycle Times, Inspection Depth
Publication Date: 3/12/2013

Duluth, GA — Viscom AG developed a new proprietary camera module, the XM. The camera module is an essential part of an automated optical inspection (AOI) system as it helps determine throughput and inspection depth during assembly inspection. With an image capture rate of up to 1.8 gigapixel/sec ...
search login