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ACD EMS: PoP Assembly Services
Publication Date: 10/11/2013

Richardson, TX — ACD, an EMS supplier to the electronics industry of Package-on-Package (PoP) assembly is geared toward supporting high-mix, high-technology assembly from prototypes through low-to-mid-volume production. With a focus on high-end technology, ACD runs two shifts to respond to a variety ...
Agilent Intros Faster RF Signal Generation
Publication Date: 10/11/2013

Santa Clara, CA, — Agilent Technologies Inc. (NYSE: A) has introduced the M9391A, a 1MHz to 3 or 6GHz PXIe vector signal analyzer, with up to 160MHz bandwidth designed to test the latest wireless standards. Used in combination with the company's modular X-series applications, the M9391A delivers ...
Aqueous Technologies: Defluxing and Cleanliness Testing
Publication Date: 10/11/2013

Rancho Cucamonga, CA — Aqueous Technologies is introducing its Trident XLD zero discharge defluxing and cleanliness testing system. The Trident XLD is the industry's environmentally responsible fully automated defluxing and cleanliness testing system. It is capable of removing all flux types including ...
ASM: Consistent Workflows for Electronics Production
Publication Date: 10/11/2013

Munich, Germany — ASM is showing off the latest versions of the SIPLACE X, SIPLACE SX, SIPLACE CA and SIPLACE Di placement platforms with their exceptional speed and flexibility for NPI processes, high-volume runs and quick product changeovers. In addition, the SIPLACE team is demonstrating that ...
BTU: DYNAMO 8A Model
Publication Date: 10/11/2013

North Billerica, MA — BTU International, Inc., has introduced its convection reflow oven platform DYNAMO 8A.
Count On Tools: New StripFeeder and Repair Services
Publication Date: 10/11/2013

Gainesville, GA — Count On Tools, Inc. (COT), has introduced its StripFeeder Modular (.mod) System version 2. According to the company, the award-winning StripFeeder System is the best solution for loading tape-and-reel components onto compact modules for prototyping and high-mix low-volume applications ...
Data I/O: New High-Performance Automated Programming System
Publication Date: 10/11/2013

Redmond, WA — Data I/O Corporation (NASDAQ: DAIO) has introduced the PSV7000 automated programming system, describing it as the world's premier automated programming system with the speed, flexibility and fast changeover to handle complex jobs at up to 50 percent lower cost.
ECT Connector Solutions
Publication Date: 10/11/2013

Pomona, CA — Everett Charles Technologies' (ECT) innovative solutions include its Tilt Universal Grid Prober, incorporating tilt technology that is said to provide the world's most advanced fixture solution. According to the company, it provides reliable testing down to 0.015-in. (0.38mm) targets ...
EPCOS SMD NTC Thermistors from TDK
Publication Date: 10/11/2013

Iselin, NJ — TDK Corporation has introduced two new series of narrowly toleranced EPCOS NTC thermistors in EIA 0402 and 0603 SMD case sizes. These components have a rated resistance of 10kΩ in tolerance classes ±1, ±3 and ±5 percent, and use a ceramic substrate.
FCT Assembly Intros Paste Printing Technology
Publication Date: 10/11/2013

Greeley, CO — FCT Assembly's new NanoSlic stencil is said to be the most advanced stencil technology available for solder paste printing. The new NanoSlic stencil is based on the proven Slic stencil with its advanced foil composition and FCTA's state-of-the-art laser cutting process. A permanent ...
Fuji America Releases Auto Splicing Unit
Publication Date: 10/11/2013

Vernon Hills, IL— Fuji America has released a new automation and labor-saving tool — the Auto Splicing Unit. Currently, companies around the world are faced with rapidly rising wage demands, which makes it increasingly important to automate tasks. Fuji is developing various automation and labor ...
GPD Global: Improved Dispensing Reliability and Accuracy
Publication Date: 10/11/2013

Grand Junction, CO — GPD Global is highlighting its precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R and D production.
Indium's SACM: High-Reliability Solder Alloy
Publication Date: 10/11/2013

Utica, NY — Indium Corporation is showing its new technology platform using the SACM, a high-reliability solder alloy that offers drop-shock test performance far superior to other SAC alloys, without compromising on thermal cycling. Its low silver content makes it a cost-effective solution for ...
Inovaxe: Material Handling Solutions
Publication Date: 10/11/2013

Deerfield Beach, FL — Inovaxe, a provider of innovative material handling and inventory control systems, is highlighting its Ultra Lean Total Material Handling and Storage Solution that addresses the challenges of dealing with SMT parts and kits within the stockroom and WIP locations.
Koh Young Intros New SPI Platform
Publication Date: 10/11/2013

Seoul, Korea — Koh Young Technology is showing off its 3D SPI, AOI, and advanced automated inspection and measurement equipment for the electronics manufacturing industry worldwide. This includes new SPI and AOI measurement technology.
LPKF Presents Four New Systems
Publication Date: 10/11/2013

Garbsen, Germany — LPKF is presenting four new systems and procedures, including a spectacular new development, the ProtoMat D104. ProtoMats are circuit board plotters which carve circuit tracks out of fully coated base materials by negative contour routing. They are able to change tools automatically and to ...
Manual Test Fixture from Ingun
Publication Date: 10/11/2013

Konstanz, Germany — The Manual Test Fixture series MA 21xx from Ingun Prufmittelbau GmbH distinguishes itself with a high contacting force, a modular interface and excellent ergonomics. The contacting force achieves impressive values, which were, until now, only achieved with vacuum test fixtures ...
MEK's Latest 5D SPI Has New Sensor Technology
Publication Date: 10/11/2013

Oirschot, The Netherlands — Mek Europe BV, formerly known as Marantz Business Electronics, recently launched its latest automated solder paste inspection system. The Model S1 mkII incorporates patented second generation sensor technology that enables special, simultaneous 2D and 3D inspection. ...
Metcal and DG Marketing: Leading Rework Systems
Publication Date: 10/11/2013

Garden Grove, CA — Metcal is unveiling its new MX-5200 Soldering, Desoldering and Rework Series, and is also highlighting the Scorpion Rework System.
Metcal: New Rework Equipment
Publication Date: 10/11/2013

Garden Grove, CA — Metcal is showing its new MX-500 Soldering and Rework System and HCT2-120 Hot Air Pencil. The updated MX-500 builds on the features that make it an icon in the industry while adding features and updating its appearance with an exciting new look. The system utilizes SmartHeat® Technology ...
 
 
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