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ARCHIVE >  December 2013 Issue >  Hi-Tech Events > 

SEMICON Japan 2013 Focuses on Power of Innovation
Tokyo, Japan — SEMI has lined up an exceptional program of keynote speakers for SEMICON Japan 2013 including: Ryoji Chubachi, AIST; Ajit Manocha, GLOBALFOUNDRIES; and Paul Boudre, Soitec.

SEMICON Japan 2013, described as one of the largest exhibitions in the world for semiconductor manufacturing and related processing technology, will take place at Makuhari Messe in Chiba on December 4-6.

In addition, the 32nd annual SEMI Technology Symposium (STS) provides an international forum for device manufacturers and equipment and materials suppliers to discuss the challenges and perspectives of the industry's technology trends.

Restructuring and consolidation has led to a new focus for the semiconductor manufacturers in Japan. As a result, the semiconductor equipment market in Japan will experience growth in 2014, driven by higher spending for memory production and in spending increases planned for the manufacturing of power semiconductors and "More than Moore" semiconductor technologies. Total equipment spending in Japan is estimated to reach $4.0 billion by 2014. Combining this with the $8 billion spending on semiconductor materials, Japan represents about a $12 billion market in 2014 for the suppliers of equipment and materials.

Leading the investment activity in Japan is Flash Alliance, the joint-venture between Toshiba and Sandisk. According to the SEMI World Fab Forecast database, equipment spending for Flash Alliance could approach between $1.8 billion to $2.3 billion this calendar year and even more in 2014 because of the overall strong market demand for NAND flash in mobile products. Toshiba has announced plans to spend up to $300 million (30B yen) to construct the Fab 5 phase 2 at the Yokkaichi plant location. This new fab will ramp for production of sub-20nm/3D flash memories, with building construction completed by about mid 2014.

In addition, a number of other Japanese semiconductor companies are very active and are aiming to grow their share in the power semiconductor device market. While more information will be available at SEMICON Japan, key investment-related activities involve: Fuji Electric, Toshiba, Mitsubishi Electric, Panasonic, and Hitachi. While the semiconductor industry and device makers have experienced a period of retrenchment and consolidation, new investments for this year and next point to a rebound in equipment spending in Japan.

SEMICON Japan 2013 will offer the opportunity to explore key technologies and business models necessary to grow in the coming years. On December 4, SEMICON Japan 2013 will start with the Opening Keynotes featuring three global executives to speak about industry growth into the future. Ryoji Chubachi, president at National Institute of Advanced Industrial Science and Technologies, believes that the total strength of entire semiconductor supply chain from materials and equipment to device still exists in Japan and facilitating open innovations will lead Japan to resume its position in the global semiconductor industry.

Ajit Manocha, CEO at GLOBALFOUNDRIES, will examine the evolution and future of the foundry model, the technical and business drivers reshaping the landscape, and how fabless and IDM companies must change their perspective on what has worked in the past, regardless of how you define "leading edge". Paul Boudre, CEO at Soitec, will illustrate how engineered substrate technologies can bring innovation by pushing "Moore's law" and "More than Moore" further in the mobile era where the electronic industry is driven by the "always connected" trend and insatiable user demand.

Special programs at SEMICON Japan include: on December 5, a 450mm Transition Update Forum with speakers from G450C, imec, Nikon, and Tokyo Electron; on December 4, an EHS Standards Workshop "Challenges for 450mm" and a 450 Manufacturing EHS and Facilities Seminar; and on December 6, "Notchless System: 450 Standard Considered". In addition, on December 5-6, numerous programs on 3D-IC include: 3D-IC Summit "Key to a Quantum Leap," OSAT Executive Forum, TA&P Night plus three programs on TechSTAGEs.

Leading-edge semiconductor manufacturing technologies will be exhibited on the SEMICON Japan show floor in three zones: Front-end Process and Back-end/Materials & Overall Process. In addition, the floor will feature focused pavilions on: Advanced Electronics Technology; Chemical Materials Management; Micro Fabrication & Fine Process Technology; Advanced Manufacturing Technology; Supply Chain; Secondary Equipment and Service and Venture.

Contact: SEMI, 3081 Zanker Road, San Jose, CA 95134 408-943-6900 fax: 408-428-9600 E-mail: jeventinfo@semi.org Web:
http://www.semi.org or http://www.semiconjapan.org

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