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Saturday, December 16, 2017
VOLUME - NUMBER
Front Page News
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Special Features: Test and Measurement
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February 2014 Issue
Front Page News
Old Coils May Hold Key to Fusion Power
Albuquerque, NM — A surprising effect created by a 19th-Century device called a Helmholz coil offers clues about how to achieve controlled nuclear fusion — a discovery made at Sandia National Laboratories, using its powerful "Z" machine.
Hazardous Materials Labeling: It's a Bloody Mess
Washington, DC — Millions of pounds of chemical products are shipped between countries daily, often with inconsistent or inappropriate labeling. Many if not most of these products offer health hazards that must provide warning in the labeling — usually in the form of graphic pictograms (icons) that are supposed ...
AZ Congresswoman Sinema Tours Isola Plant
Bannockburn, IL — Congresswoman Kyrsten Sinema (AZ-9) visited Isola's manufacturing and R&D facilities in Chandler, Arizona on Friday, January 3 to learn about the issues that concern the developer and manufacturer of materials used to fabricate advanced printed circuit boards.
SEMI: North American Semiconductor Equipment Industry Posts November 2017 Billings
MILPITAS, CA - North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November
Equipment Market Data Subscription
(EMDS) Billings Report published today by SEMI.
Avnet Sponsors The Not Impossible Awards Recognizing Emerging Technologies that Improve Lives
Avnet, a leading global technology distributor, today announced its title sponsorship of The Not Impossible Awards, which recognizes the breakthrough achievements of innovators who share the Not Impossible Labs mission to create inventive technology that improves the well-being of others.
aveni® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating Chemistry
MASSY, France - aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.
Kilopass NVM OTP IP Achieves 3-Lot Qualification on GLOBALFOUNDRIES 14nm LPP (Low Power Process) Process Technology
SAN JOSE, CA - Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced that it successfully achieved a three-lot qualification on GLOBALFOUNDRIES (GF) 14nm LPP (Low Power Process) technology platform for its one-time programmable (OTP) NVM technology.
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