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ARCHIVE >  March 2014 Issue >  Front Page News > 

Semicon Growth Faces Serious Cost Challenges

New York, NY — Even though many analysts are projecting growth for the global semiconductor industry in 2014, structural challenges in the industry could threaten many companies, as more than half of 191 of the industry's publicly-listed companies face the risk of possible financial distress. As a result, the ...

End-of-Life Doesn't Have to Kill Mother Earth


Denver, CO — End-of-life management of electronics, or lack thereof, has become a serious part of our overall ecological contamination. It's no longer enough to simply consign junked electronics to landfills — even after shredding. The landfills after all can accommodate only ...



 
 
IPC Delivers the First Automotive Standard on Performance Requirements for Rigid Printed Boards
BANNOCKBURN, IL - In September of 2015, IPC delivered revision D of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards. Building on this base standard, IPC has developed the first automotive addendum, IPC-6012DA, Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards.

 
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