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Archive >  June 2014 Issue >  Front Page News > 

Linking Atomic Structure to Parts Performance

Albuquerque, NM — Humans have used metals for thousands of years, but there's still a lot about them that isn't fully understood. Just how much stretching, bending or compression a particular metal will take is determined by mechanical properties that can vary widely, even within parts made of the ...

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Wearable Electronics: Here Come the Novelty Peaks


Last Christmas and New Year the ideal present for a girl of a certain age, from Japan to the UK was the neurowear clip-on of floppy ears driven by brain waves to reflect your mood. They would have been played with for one day and then put away forever. Such novelty peaks can be expected with many ...
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Attracting Larger U.S. Workforce to Growing Manufacturing Industries

Rolling Meadows, IL — With the market continuing to drive up demand for more workers in numerous manufacturing industries, the Association for Manufacturing Excellence (AME) is leading the charge to reinvigorate the national workforce and attract new personnel. AME continues to connect experienced workers with ...
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International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced
SAN JOSE, CA - The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.


LUTZE Introduces Teal Ethernet Cat5e Cable
CHARLOTTE, NC - Data transmission is critical for success in today’s manufacturing environment. LUTZE’s new flexible Cat5e AWM 600V Ethernet cable (part#104349) is engineered to protect your data from harmful interference ensuring uninterrupted data transmission and long term network reliability.
 

NXP Announces Production of Security Chips in its US Manufacturing Facilities
AUSTIN, TX; CHANDLER, AZ - NXP Semiconductors N.V. today announced a $22 million dollar program that expands its operations in the United States, enabling the Company’s US facilities to manufacture security chips for government applications that can support critical US national and homeland security programs.
 

 
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