PLYMOUTH, MA - A new paper from Tech-Etch describes processes necessary to manufacture high reliability flexible circuits used in the diagnostic imaging, patient monitoring, cardiac management, and life science industries. Flexible circuits provide the thinnest and lightest interconnect method available. Their extreme thinness makes them very well suited for dynamic applications where the flex will be in constant or periodic motion. They contribute to reducing overall system complexity by facilitating assembly and eliminating wiring errors. Flexible circuits will conform to the available geometry for connections of electronics located on different planes within the finished electronic device. This capability is sometimes referred to as 3D packaging.
Manufacturing processes include use of UV Yag Lasers, Automated Plated Through Holes, Laser Direct Imaging (LDI), Additive Copper Processing, Subtractive Copper Processing, Automated Optical Inspection, as well as Finishing Options, Flex Assembly and Circuit Testing. Topics include flex circuit substrates, plated through vias, coverlayer construction, component assembly, plus stiffener and interconnection options. Photography of flex circuits illustrates the diverse processes available to produce these high reliability products. Flex circuit dimensions and tolerances are outlined.
Tech-Etch is celebrating 50 years of providing quality products to industry. Registered to ISO 9001:2008, the company manufactures high reliability flexible printed circuits, photo etched precision parts, and a complete line of standard and custom EMI/RFI shielding products.
Visit the web site at www.tech-etch.com/flex to download the paper on "High Reliability Flexible Circuits for the Medical Marketplace."