||SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, plans to feature the ALPHA® Argomax® 9000 Silver Sintering Preforms at the 2017 APEC show, Booth #1232, to be held in Tampa, Florida from March 26th – 30th.
“Up until recently, this technology has only been available in both paste and film formats, but now we are the first to introduce a sintering product in a preform format to widen our product portfolio and extend the superior capabilities of Argomax®”, said Julien Joguet, Alpha’s Global Product Manager for Sintered Materials. “These innovative preforms deliver superior thermal conductivity, ultra-high reliability and excellent electrical conductivity, in addition to easy handling and processability.”
Argomax® 9000 Preforms are proving to be the most reliable die attach materials in the Power Semiconductor Industry and can be used in a range of applications from power modules to heat sink attach and automotive applications, in areas in which thermal and electrical conductivity and joint strength is crucial. The preforms are available for sampling in tape and reel format and waffle pack for standard pick and place equipment.
For more information on how ALPHA® Argomax® 9000 Silver Sintering Preforms can demonstrate excellent performance in large area attachment and simplify the manufacturing process, visit Alpha at APEC, Booth #1232.