Friday, December 15, 2017
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Indium Corporation Expert Presents at EDI CON USA
CLINTON, NY - Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the Electronic Design Innovation Conference (EDI CON) and Exhibition 2017, Sept. 11-13 in Boston, Mass.

Sandy-Smith will present Overcoming Assembly Challenges with Bottom Termination Components (BTCs). This presentation will review the updated recommendations for design and implementation of BTCs, including major changes made to IPC-7093. Sandy-Smith will also share strategies to minimize voiding and ensure robust BTC assemblies.

Sandy-Smith is a Technical Support Engineer specializing in printed circuit board assembly materials, particularly solder paste. She conducts application testing and qualifications for new product introductions. Sandy-Smith earned degrees in chemical engineering (with a focus on materials) and German language from the University of Rhode Island. She previously worked in R&D, developing conductive adhesives for die- and strap-attach, as well as conductive inks for RFID applications. Her areas of expertise include analytical testing of conductive materials, applications such as screen-printing and jet dispensing (jetting), as well as scale-up and pre-production of developmental materials.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

 
 
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