Tuesday, December 12, 2017
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TRI Brings New Perspective for 3D Inspection at SMTA International 2017
TAIPEI, TAIWAN - Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry will join SMTA International 2017 held at Donald E. Stephens Convention Center in Rosemont, IL to showcase its latest 3D automated inspection solutions for PCBA manufacturing. Visit TRI at booth #424 or join an SMTAI Tech Tour to discover the newest applications in 3D SPI, AOI and CT AXI and discuss your quality issues with TRI's experts.

TRI's VP of Sales and Marketing Jim Lin commented on the occasion, "We are thrilled to see how TRI 3D solutions help our customers increase production efficiency. This year we are bringing the inspection performance and factory integration to a whole new level.”

Presenting an integrated solution for the PCBA production line, TRI will exhibit the Global Technology Award-winning TR7007QI 3D SPI, along with market leading 2D + 3D AOI solution TR7500QE offering unique side view inspection. Both systems deliver industry leading performance based on CoaXpress Imaging Technology. We will showcase the world’s most powerful Tiny In- Circuit-Tester Solution, TR5001T SII TINY.

Join an SMTA International Tech Tour and visit us at booth #424. Our experts will demonstrate the advantages of TRI’s Industry 4.0- ready smart inspection software and our high performance hardware design can bring to your production.

Learn more at http://www.tri.com.tw. For sales and service information, write us at triusa@tri.com.tw or call +1 (408) 567-9898.

 
 
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