Clinton, NY - Indium Corporation experts will share their knowledge and expertise at IMAPS 50th International Symposium on Microelectronics, Oct. 10-12, in Raleigh, NC.
Vice President of Technology Dr. Ning-Cheng Lee will teach a professional development course, Choosing Solders for the New Era: Low-Cost High-Reliability Solder Alloys. This course explores the roles of solder composition in relation to cost and reliability, including materials properties, soldering performance, known failure modes, and the primary merit of discussed alloys.
Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will co-chair a session on polymers in microelectronics (WA5). This session focuses on the development of polymers for use as encapsulates, dielectrics, conductors, and resistors for use in microelectronic devices.
Tim Jensen, Product Manager for Engineered Solders Materials, will present Reinforced Solder Technology for Increased Reliability. The presentation details the outcomes of a study that showed how, through an optimized design, a reinforced solder preform can produce a solder joint with high-reliability and low-voiding.
Jensen will also co-chair a session on reliability (THA5). This session focuses on several facets of electronics reliability that are impacted as devices generate more power from smaller form factors in broader ranges of applications.
To register for the IMAPS conference, visit: www.imaps.org/imaps2017.