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Indium Corporation Features Indium3.2HF Solder Paste for Fine Feature Printing at IWLPC 2017
CLINTON, NY - Indium Corporation will feature its Indium3.2HF Solder Paste at the 14th International Wafer-Level Packaging Conference (IWLPC 2017—Silicon to Systems), Oct. 24-26, in San Jose, Calif.

Indium Corporation’s Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated for fine feature printing applications (Type 6SG).

Indium3.2HF is formulated to offer consistent, repeatable printing performance combined with a long stencil life. In addition, Indium3.2HF delivers:

• Good response-to-pause
• A wide reflow profile window
• Outstanding slump resistance
• Excellent wetting capability
• Superior fine-pitch soldering ability

From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications.

For more information on Indium Corporation’s materials for SiP or Indium3.2HF Solder Paste, go to or visit Indium Corporation’s booth 39.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

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