Thursday, October 19, 2017
VOLUME - NUMBER
Advertisements
Home/Current Issue >  Daily News Archive > 

Nordson DAGE to Discuss Its Wafer X-ray Metrology Platform at IWLPC
AYLESBURY, UK - Nordson DAGE, a division of Nordson Corporation, announces plans to exhibit at the 14th annual International Wafer-Level Packaging Conference (IWLPC) Expo, scheduled to take place Oct. 24-26, 2017 in San Jose, CA. The Nordson DAGE inspection experts will discuss the XM8000 Wafer X-ray Metrology Platform in Booth #1.

The semiconductor market demands increasingly complex devices that are enabled by technologies such as TSV, PoP, 2.5D and 3D integration. These complex products demand a new level of metrology. Nordson DAGE, the leader in X-ray inspection for the electronics industry, presents the XM8000 X-ray metrology platform, for the fast, fully-automated, non-destructive measurement of, and within, metal features on up to 300 mm wafers.

The XM8000 system delivers fully automated, non-destructive, radiation safe defect detection for all complex devices, and is 30X faster than traditional X-ray. This new platform takes the market-leading capabilities from Nordson DAGE’s existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps.

For more information, visit www.nordsondage.com.

 
 
search login