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Tuesday, November 21, 2017
VOLUME -22 NUMBER 5
Publication Date: 05/1/2007
Front Page News
People in the News
Contract Mfg. Products
Special Feature: Components & Disty
Product Preview: Electronics Distribution Show (EDS)
May 2007 Issue
Front Page News
Researchers Bend Nanowires, Create New Components
By John Toon
Atlanta, GA — Researchers have taken advantage of the unique coupled semiconducting and piezoelectric properties of zinc oxide nanowires to create a new class of electronic components and devices that could provide the foundation...
Container Ports Get RFID Tracking Security
Charleston, SC and Mountain View, CA — The South Carolina State Ports Authority (SCSPA) and Savi Networks have agreed to extend the SaviTrak
information service to three container terminals at the Port of Charleston to enhance the security and efficiency of in-transit cargo shipments.
February Book-to-Bill In Upswing
Bannockburn, IL — The North American rigid PCB industry book- to-bill ratio for February 2007 climbed to 0.96, while the North American flexible circuit book-to-bill ratio increased to 0. ...
KYZEN Climbs to New Heights
On November 2, 2017, KYZEN Employee TC Loy finally began his long-awaited quest to climb Mount Everest. After two years of preparation and delays due to Mother Nature, TC and a group of friends set out for Lukla, located in Northeastern Nepal, where locals welcomed them to the Himalayas (near Mount Everest) to begin their journey.
Nano Global, Arm Collaborate on Artificial Intelligence Chip to Drive Health Revolution by Capturing and Analyzing Molecular Data in Real Time
AUSTIN, TX - Nano Global, an Austin-based molecular data company, today announced that it is developing a chip using intellectual property (IP) from Arm, the world’s leading semiconductor IP company. The technology will help redefine how global health challenges - from superbugs to infectious diseases, and cancer are conquered.
ClassOne Slashes Via Liner Plating Costs for Compound Semi
KALISPELL, MT - ClassOne Technology (
), manufacturer of Solstice® plating systems for ≤200mm wafers, announced a new plating technique that provides significant cost reductions for compound semiconductor manufacturers who use gold plated vias.
"We have compound semiconductor customers that use gold for via liners who are switching to copper to save money," said Kevin Witt, President of ClassOne Technology.
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