Monday, March 27, 2017
VOLUME -22 NUMBER 5
Publication Date: 05/1/2007
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Archive >  May 2007 Issue >  Front Page News > 
Researchers Bend Nanowires, Create New Components


Atlanta, GA — Researchers have taken advantage of the unique coupled semiconducting and piezoelectric properties of zinc oxide nanowires to create a new class of electronic components and devices that could provide the foundation...
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Container Ports Get RFID Tracking Security

Charleston, SC and Mountain View, CA — The South Carolina State Ports Authority (SCSPA) and Savi Networks have agreed to extend the SaviTrak information service to three container terminals at the Port of Charleston to enhance the security and efficiency of in-transit cargo shipments. Read More
February Book-to-Bill In Upswing

Bannockburn, IL — The North American rigid PCB industry book- to-bill ratio for February 2007 climbed to 0.96, while the North American flexible circuit book-to-bill ratio increased to 0. ...Read More


 
 
European SEMI Award Honors Advanced Packaging Technologists
MUNICH, GERMANY - At the SEMI Industry Strategy Symposium in Munich, SEMI announced recipients of the European SEMI Award for 2016: Rolf Aschenbrenner, deputy director of the Fraunhofer IZM; Eric Beyne, fellow and program director of 3D System Integration at imec; and Gilles Poupon,
 

SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux
JALISCO, MEXICO - Omega Aleaciones S.V. Sales and Application Engineering Team reinforces SHENMAO’s commitment to providing our worldwide EMS and OEM customers with the highest quality and technical solutions Solder Paste to meet the challenges of today’s SMT Assembly and Product Reliability throughout Mexico.

MEMS & Sensors Industry Group Tackles Technical Challenges at Annual Technical Congress: May 10-11 at Stanford University (Stanford, CA)
PITTSBURGH, PA - Microelectromechanical systems (MEMS) and sensors suppliers are targeting a rapidly growing global market for their devices, key components that increase the intelligence and interactivity of billions of electronic products.
 

 
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