Monday, October 23, 2017
VOLUME -22 NUMBER 6
Publication Date: 06/1/2007
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Archive >  June 2007 Issue >  Front Page News > 
NIST: Tabletop Antenna Calibration to 110GHz

Boulder, CO — The National Institute of Standards and Technology (NIST) has developed a new "tabletop" sized facility to improve characterization of antennas operating in the 60 to 110GHz frequency range. This extended frequency capability serves needs for advanced civilian and military communic ...
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Soldier-Testing of Future Combat Systems Clears Design Hurdles

St. Louis, MO — The Boeing Company (NYSE: BA) and Science Applications International Corporation (SAIC) (NYSE: SAI), functioning as the Lead Systems Integrator for the U.S. Army's Future Combat Systems (FCS) program, have successfully completed an eight-month experiment that is a cornerstone of soldier evaluation activities and an important step toward the early infusion of key FCS capabilities to the current force.
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Book-to-Bill Shows Small Gain

Bannockburn, IL — The North American rigid PCB industry book-to-bill ratio for March 2007 inched up to 0.99. The North American flexible circuit book-to-bill ratio jumped up to 1.18. The combined (rigid and flex) industry book-to-bill ratio in March 2007 reflected these gains, increasing to 1.00 according ...Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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