Friday, December 2, 2016
VOLUME -22 NUMBER 6
Publication Date: 06/1/2007
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Archive >  June 2007 Issue >  Front Page News > 
NIST: Tabletop Antenna Calibration to 110GHz

Boulder, CO — The National Institute of Standards and Technology (NIST) has developed a new "tabletop" sized facility to improve characterization of antennas operating in the 60 to 110GHz frequency range. This extended frequency capability serves needs for advanced civilian and military communic ...
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Soldier-Testing of Future Combat Systems Clears Design Hurdles

St. Louis, MO — The Boeing Company (NYSE: BA) and Science Applications International Corporation (SAIC) (NYSE: SAI), functioning as the Lead Systems Integrator for the U.S. Army's Future Combat Systems (FCS) program, have successfully completed an eight-month experiment that is a cornerstone of soldier evaluation activities and an important step toward the early infusion of key FCS capabilities to the current force.
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Book-to-Bill Shows Small Gain

Bannockburn, IL — The North American rigid PCB industry book-to-bill ratio for March 2007 inched up to 0.99. The North American flexible circuit book-to-bill ratio jumped up to 1.18. The combined (rigid and flex) industry book-to-bill ratio in March 2007 reflected these gains, increasing to 1.00 according ...Read More


 
 
Murphy, Choh and Pilla Join ClassOne Technology's Board of Advisors
KALISPELL, MT - ClassOne Technology (www.classone.com), manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.
 

Indium Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016
CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.

Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.

Ventec International Group Focus On High Thermal Performance Materials for Automotive and LED Applications at HKPCA 2016, China
SUZHOU, CHINA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in Booth #4B16 at HKPCA, China, scheduled to take place December 7th-9th, 2016 at the Shenzhen Convention & Exhibition Center, China.

 
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