Saturday, May 26, 2018
VOLUME -22 NUMBER 6
Publication Date: 06/1/2007
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Archive >  June 2007 Issue >  Front Page News > 
NIST: Tabletop Antenna Calibration to 110GHz

Boulder, CO — The National Institute of Standards and Technology (NIST) has developed a new "tabletop" sized facility to improve characterization of antennas operating in the 60 to 110GHz frequency range. This extended frequency capability serves needs for advanced civilian and military communic ...
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Soldier-Testing of Future Combat Systems Clears Design Hurdles

St. Louis, MO — The Boeing Company (NYSE: BA) and Science Applications International Corporation (SAIC) (NYSE: SAI), functioning as the Lead Systems Integrator for the U.S. Army's Future Combat Systems (FCS) program, have successfully completed an eight-month experiment that is a cornerstone of soldier evaluation activities and an important step toward the early infusion of key FCS capabilities to the current force.
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Book-to-Bill Shows Small Gain

Bannockburn, IL — The North American rigid PCB industry book-to-bill ratio for March 2007 inched up to 0.99. The North American flexible circuit book-to-bill ratio jumped up to 1.18. The combined (rigid and flex) industry book-to-bill ratio in March 2007 reflected these gains, increasing to 1.00 according ...Read More


 
 
Indium Corporation to Feature AuSn Solder Preforms at International Microwave Symposium
CLINTON, NY - Indium Corporation will feature its precision AuSn solder preforms at International Microwave Symposium (IMS) 2018 from June 10-15 in Philadelphia, Penn.

Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing.         

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
 
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