Wednesday, May 23, 2018
VOLUME -22 NUMBER 7
Publication Date: 07/1/2007
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Archive >  July 2007 Issue >  Front Page News > 
Transparent Transistors Herald New Displays, E-Paper


West Lafayette, IN — Researchers at Purdue University have used nanotechnology to create transparent transistors and circuits, a step that promises a broad range of applications, from e-paper and flexible color screens for consumer electronics to "smart cards" and "heads-up" displays ...
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Quantum Key System Combines Speed & Distance

Gaithersburg, MD — Researchers at the National Institute of Standards and Technology (NIST) have built a prototype high-speed quantum key distribution (QKD) system, based on a new detector system that achieves dramatically lower noise levels than similar systems. The new system, they say, can perform a theoretically ...Read More
Book-to-Bill at Parity

Bannockburn, IL — Domestic rigid PCB shipments for the month of April are down 12.8 percent and bookings are down 11.8 percent from April 2006, according th\o figures released by the IPC - Association Connecting Electronics Industries®. Year to date, rigid PCB shipments are down 9.9 percent and bookings are ...Read More


 
 
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 
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