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Wednesday, July 26, 2017
VOLUME -22 NUMBER 7
Publication Date: 07/1/2007
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Electronic Mfg. Services
Electronic Mfg. Products
Components and Distribution
Product Preview: SEMICON WEST
July 2007 Issue
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New IPC Design Conference in August
Bannockburn, IL — IPC — Association Connecting Electronics Industries — is presenting a one-of-a-kind conference that encourages manufacturers to start at the very beginning — the design. The IPC Global Design Conference: Building Better Today for Tomorrow, will be held August 15-16, 2007, at Delta Toronto East in Scarborough, Ontario, Canada.
"Let's face it, the design of the printed circuit board is the foundation for all the other processes," affirms Jean Hebeisen, director of the IPC Designers Council and professional development. "The design affects the end product, and ultimately the bottom line. It is amazing how often the training and continuing education of the designer is overlooked."
CEO of FTG Circuits, Brad Bourne, will kick off the two-day event with a keynote address, "Meeting the Manufacturer's Needs." Industry experts from companies such as Celestica, Honeywell,
Electrochemicals and Cisco Systems will present on a variety of crucial topics for today's designers, including metal foils for high-speed signals, optimum transmission line parameters, metric pitch BGA and micro BGA, flexible circuit design, lead free, the IDF process and advanced technologies — high-density interconnects (HDI) and embedded passives.
For designers with an eye on manufacturability, a DfM workshop will be held August 13-14. In addition, designers looking to achieve the ultimate in recognition, the designers certification and advanced certification, certification workshops and exams will be held August 16-18.
For more information, contact: IPC
847-509-9700 fax: 847-509-9798 Web:
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