Tuesday, May 22, 2018
VOLUME -22 NUMBER 8
Publication Date: 08/1/2007
Advertisements

Archive >  August 2007 Issue >  Front Page News > 
Aging AWACS Gets Money-Saving Diagnostics


Kissimmee, FL — We're not too far removed from a time when the DoD came under fire for overly costly toilet seats and hammers, so it's especially gratifying to find a company that has saved many millions of dollars of taxpayer money for the government.
Read More
Active RFID On the Upswing

Cambridge, UK — Will active (battery powered) RFID overtake the more common passive variety? It represents a high growth segment of the total RFID market, according to "The IDTechEx report Active RFID and Sensor Networks 2007-2017."Read More
Flex Circuits Continue Strong Showing

Bannockburn, IL — Rigid PCB shipments are down 14.8 percent and bookings are down 12.2 percent in May 2007 from May 2006. Year to date, rigid PCB shipments are down 10.9 percent and bookings are down 17.7 percent, according to the latest report from Read More


 
 
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 
search login