Tuesday, August 30, 2016
VOLUME -22 NUMBER 8
Publication Date: 08/1/2007
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ARCHIVE >  August 2007 Issue >  Front Page News > 
Aging AWACS Gets Money-Saving Diagnostics


Kissimmee, FL — We're not too far removed from a time when the DoD came under fire for overly costly toilet seats and hammers, so it's especially gratifying to find a company that has saved many millions of dollars of taxpayer money for the government.

Active RFID On the Upswing

Cambridge, UK — Will active (battery powered) RFID overtake the more common passive variety? It represents a high growth segment of the total RFID market, according to "The IDTechEx report Active RFID and Sensor Networks 2007-2017."
Flex Circuits Continue Strong Showing

Bannockburn, IL — Rigid PCB shipments are down 14.8 percent and bookings are down 12.2 percent in May 2007 from May 2006. Year to date, rigid PCB shipments are down 10.9 percent and bookings are down 17.7 percent, according to the latest report from


 
 
Industry Veteran Lung Chu Named President of SEMI China
SAN JOSE, CA - SEMI today announced the appointment of Lung Chu as president of SEMI China effective September 1, 2016. With the recent broadening ambitions for China’s indigenous semiconductor supply chain, Lung Chu joins SEMI at a critical inflection in the China market. Chu will be instrumental in evolving and repositioning SEMI’s programs, committees, products and services in China to deliver the highest member value in the rapidly changing China semiconductor ecosystem.

Alpha to Feature Material Set Combinations for Greatest Reliability at SMTA Guadalajara Expo
SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will feature material set combinations to include paste, tacky flux, cored wire and wave soldering flux that are tested with one another to achieve greater reliability at the SMTA Guadalajara Expo to be held October 5th-6th in Guadalajara, Jal. MÉXICO.

Indium Corporation Experts to Present at IEMT–EMAP 2016
CLINTON, NY - Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.

Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will deliver the keynote address, The Future of Power Device Packaging: Materials and Assembly Processes.

 
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