Friday, December 15, 2017
VOLUME -22 NUMBER 10
Publication Date: 10/1/2007
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Archive >  October 2007 Issue >  Front Page News > 
Fuel Cells Power UAVs and Manned Aircraft

Atlanta, GA — Georgia Tech researchers have conducted successful test flights of a hydrogen-powered unmanned aircraft powered by a proton exchange membrane (PEM) fuel cell using compressed hydrogen. In tests, the aircraft has to date reached an altitude of 25 meters, followed down an automotive track ...
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NIST Debuts Superconducting Quantum Computing Cable

Gaithersburg, MD — Physicists at the National Institute of Standards and Technology (NIST) have transferred information between two "artificial atoms" by way of electronic vibrations on a microfabricated aluminum cable, demonstrating a new component for potential ultra-powerful quantum computers of the future ...Read More
"US Tech Interactive" Is Launched in China

Valley Forge, PA US Tech has just launched US Tech Interactive in Chinese (www.us-tech.cn), which is a fully translated and fully functional website prepared for engineers and electronics manufacturers in China.Read More


 
 
SEMI: North American Semiconductor Equipment Industry Posts November 2017 Billings
MILPITAS, CA - North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. 
Avnet Sponsors The Not Impossible Awards Recognizing Emerging Technologies that Improve Lives
Avnet, a leading global technology distributor, today announced its title sponsorship of The Not Impossible Awards, which recognizes the breakthrough achievements of innovators who share the Not Impossible Labs mission to create inventive technology that improves the well-being of others. 
aveni® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating Chemistry
MASSY, France - aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node. 
Kilopass NVM OTP IP Achieves 3-Lot Qualification on GLOBALFOUNDRIES 14nm LPP (Low Power Process) Process Technology
SAN JOSE, CA - Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced that it successfully achieved a three-lot qualification on GLOBALFOUNDRIES (GF) 14nm LPP (Low Power Process) technology platform for its one-time programmable (OTP) NVM technology. 
 
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