Tuesday, May 22, 2018
VOLUME -22 NUMBER 12
Publication Date: 12/1/2007
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Archive >  December 2007 Issue >  Front Page News > 
Green Trucks Help with Holiday Rush


Santa Rosa, CA — It's a funny-looking car, some would say it's "cute" while to others it's simply "weird" but everybody has some kind of opinion about this very green all-electric three-wheeler that is starting to make serious inroads in America's urban areas. The electric is known as the...
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Cancer Destroyed by Radio Waves & Nanotubes

Houston, TX — Carbon nanotubes and RF energy are the latest front runners in the search for cancer cures. In a totally unexpected development, it was found that cancer cells treated with carbon nanotubes can be destroyed by non-invasive radio waves that heat up the nanotubes while sparing untreated tissue. ...Read More
Printed Electronics and the Future of Mobile Phones


Cambridge, MA — Printed electronics is a term that covers printed and potentially printed electronics in a number of categories. It is the basis of an emerging $300 billion business embracing transistors, memory, displays, solar cells, batteries, sensors, lasers and much more. This new electronics ...Read More


 
 
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 
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