Saturday, June 24, 2017
VOLUME -23 NUMBER 2
Publication Date: 02/1/2008
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Archive >  February 2008 Issue >  Front Page News > 
Innovations Reap Huge Savings for Semiconductors

Gaithersburg, MD — A new report from the National Institute of Standards and Technology (NIST) shows that investment in measurement science has and will continue to have a dramatic effect on innovation, productivity, growth and competitiveness in and among high technology sectors. The report, "Economic
Impact of Measurement... Read More
MEMS Heart of New Military Ordnance


Atlanta, GA — MEMS technology is playing an important role in developing tomorrow's military ordnance. Tiny copper structures with pores at both the nanometer and micron size scales could play a key role in the next generation of detonators used to improve the reliability, reduce the size and lower ...
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Importers Share Responsibility for Unsafe Products

Milwaukee, WI — Tainted pet food. Lead paint on toys. While Chinese product recalls have dominated recent headlines, much of the responsibility for these quality problems lies with inadequate oversight by U.S. importers, say product experts in the latest quarterly report Read More


 
 
SV TCL Recognized as a VLSIresearch THE BEST Subsystems Supplier
TEMPE, AZ - SV Probe Pte. Ltd. (“SV TCL”), a leading global supplier of high-performance probe cards and semiconductor test solutions, today announced that VLSIresearch has released a detailed white paper with additional SV TCL results from their 2017 Customer Satisfaction Survey (“CSS”).

Micralyne and Microplex Partner to Deliver Metal "Through Silicon Via" Wafers
EDMONTON, ALBERTA - Micralyne Inc., a leading manufacturer of MicroElectroMechanical Systems (MEMS) and a primary supplier of sensors, is pleased to announce a collaboration with Microplex in Placentia, California to develop and manufacture custom wafers with Metal Through Silicon Via's (TSV). The joint development of this technology leverages the specific expertise of each company to enable a truly flexible and cost effective Metal TSV solution for sensor and semiconductor applications.
 

NFI Corp. (Nameplates For Industry) Announces New Ownership; Hingham resident takes reins of global company
NEW BEDFORD, MA - NFI Corp. (Nameplates For Industry, www.nameplatesforindustry.com), the New Bedford-based global leader in high performing printed graphic solutions, recently announced that the firm has been acquired by Renaud Megard of Hingham, Mass., who now serves as the company’s president and CEO.

SEMI Europe Applauds New Semiconductor Manufacturing Investment
BERLIN, GERMANY - SEMI Europe today commended the announcement of a new electronics manufacturing facility in Dresden, Germany and the supporting public policy to reinvigorate regional innovation. SEMI Europe, the European regional office of the global industry association SEMI, engages SEMI members to advance the global electronics manufacturing supply chain.

 
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