Friday, May 26, 2017
VOLUME -23 NUMBER 2
Publication Date: 02/1/2008
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Archive >  February 2008 Issue >  Front Page News > 
Innovations Reap Huge Savings for Semiconductors

Gaithersburg, MD — A new report from the National Institute of Standards and Technology (NIST) shows that investment in measurement science has and will continue to have a dramatic effect on innovation, productivity, growth and competitiveness in and among high technology sectors. The report, "Economic
Impact of Measurement... Read More
MEMS Heart of New Military Ordnance


Atlanta, GA — MEMS technology is playing an important role in developing tomorrow's military ordnance. Tiny copper structures with pores at both the nanometer and micron size scales could play a key role in the next generation of detonators used to improve the reliability, reduce the size and lower ...
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Importers Share Responsibility for Unsafe Products

Milwaukee, WI — Tainted pet food. Lead paint on toys. While Chinese product recalls have dominated recent headlines, much of the responsibility for these quality problems lies with inadequate oversight by U.S. importers, say product experts in the latest quarterly report Read More


 
 
SMTA and CALCE Seeking Abstracts for 3rd Annual LED Assembly, Reliability, and Test Symposium
MINNEAPOLIS, MN - The SMTA and CALCE are pleased to announce the LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 28 - November 30, 2017 at the Archie K. Davis Conference Center in Research Triangle Park, NC.


Indium Corporation Expert to Present at China Semiconductor Packaging Test Symposium (CSPT) 2017
CLINTON, NY - Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test Symposium (CSPT) on June 21-23 in Jiangyin, China.

SEMI | FlexTech and CPEIA Announce Partnership at CPES2017
MILPITAS, CA - SEMI | FlexTech (www.semi.org; www.flextech.org) and the Canadian Printable Electronics Industry Association (www.cpeia-acei.ca) have signed a Memorandum of Understanding to support each other’s programs and drive the continued development and adoption of printable, flexible hybrid, and wearable electronics (PE and FHE).

Ventec: Thomas Michels to Speak at the EIPC Summer Conference
SUZHOU, CHINA - Ventec's European Managing Director Thomas Michels will speak at EIPC Summer Conference on June 1st & 2nd, 2017 to be held at the Best Western Plus Manor Hotel, Solihull, UK.

 
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