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Thursday, May 24, 2018
VOLUME -23 NUMBER 2
Publication Date: 02/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: Components and Distribution
Product Preview: APEX
February 2008 Issue
Front Page News
Innovations Reap Huge Savings for Semiconductors
Gaithersburg, MD — A new report from the National Institute of Standards and Technology (NIST) shows that investment in measurement science has and will continue to have a dramatic effect on innovation, productivity, growth and competitiveness in and among high technology sectors. The report, "Economic
Impact of Measurement...
MEMS Heart of New Military Ordnance
By John Toon, Georgia Institute of Technology, Atlanta, GA
Atlanta, GA — MEMS technology is playing an important role in developing tomorrow's military ordnance. Tiny copper structures with pores at both the nanometer and micron size scales could play a key role in the next generation of detonators used to improve the reliability, reduce the size and lower ...
Importers Share Responsibility for Unsafe Products
Milwaukee, WI — Tainted pet food. Lead paint on toys. While Chinese product recalls have dominated recent headlines, much of the responsibility for these quality problems lies with inadequate oversight by U.S. importers, say product experts in the latest quarterly report
Indium Corporation Expert to Present at PCIM Europe
CLINTON, NY -
expert, Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present at
on Wednesday, June 6, in Nuremberg, Germany.
Vijay will present Improve Reliability and Bondline Control with InFORMS® and Indalloy®276.
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY -
is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.
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