Tuesday, February 21, 2017
VOLUME -23 NUMBER 2
Publication Date: 02/1/2008
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Archive >  February 2008 Issue >  Front Page News > 
Innovations Reap Huge Savings for Semiconductors

Gaithersburg, MD — A new report from the National Institute of Standards and Technology (NIST) shows that investment in measurement science has and will continue to have a dramatic effect on innovation, productivity, growth and competitiveness in and among high technology sectors. The report, "Economic
Impact of Measurement... Read More
MEMS Heart of New Military Ordnance


Atlanta, GA — MEMS technology is playing an important role in developing tomorrow's military ordnance. Tiny copper structures with pores at both the nanometer and micron size scales could play a key role in the next generation of detonators used to improve the reliability, reduce the size and lower ...
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Importers Share Responsibility for Unsafe Products

Milwaukee, WI — Tainted pet food. Lead paint on toys. While Chinese product recalls have dominated recent headlines, much of the responsibility for these quality problems lies with inadequate oversight by U.S. importers, say product experts in the latest quarterly report Read More


 
 
Indium Corporation Names Nash as Product Manager – PCB Solder Paste
CLINTON, NY - Indium Corporation has named Chris Nash as Product Manager for PCB Assembly Materials.

Nash is responsible for managing new solder paste product development, including strategy guidance and execution, directed to sales to the printed circuit board industry.
 

Indium Corporation Expert to Present at EPP InnovationsFORUM, Germany
CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at the EPP InnovationsFORUM on March 9 in Böblingen, Germany.



PSMA Announces APEC 2017 Industry Session on Energy Harvesting
MENDHAM, N.J.- At APEC 2017, the PSMA's (Power Sources Manufacturers Association’s) Energy Harvesting Committee will host an Industry Session featuring five industry experts who will cover such topics as real-world applications, conditional monitoring, energy harvesting systems, PMICs (Power Management ICs) and low-power IoT (Internet of Things) devices.
 

 
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