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Thursday, March 23, 2017
VOLUME -23 NUMBER 2
Publication Date: 02/1/2008
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February 2008 Issue
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Ironwood Intros 2 Hi-Performance Sockets
High performance socket with heat sink.
Burnsville, MN — Ironwood Electronics has introduced the new high performance BGA ZIF sockets for 1.0mm pitch BGA. The SG-BGA-6245, SG-BGA-6246 sockets are designed for a ST Micro 35mm and 27mm package sizes; operate at bandwidths up to 8GHz with less than 1dB of insertion loss. The sockets dissipate up to 4.5 W at 40°C and can handle up to 100 W with enhanced heat sink.
The contact resistance is typically 23 milliohms per pin. The socket requires only 2.5mm clearance around the chip so discrete components can be placed near the IC. The heat-sink installation is simple and reliable requiring only that the heat sink be rotated to the proper down force position.
The ZIF socket is constructed with high performance and low inductance elastomer. The temperature range is -35 to +100°C. The pin inductance is 10.15nH, and capacitance to ground is 0.10pF. The SG-BGA-6245 socket accommodates 35mm BGA body size IC packages with 34 X 34 array and 1156 balls; the SG-BGA-6246 accommodates 27mm BGA body size IC packages with 26 X 26 array and 676 balls. To use either socket, simply attach the socket to the PC board, drop in the chip, attach the lid, and tighten the heat-sink compression screw.
For more information, contact: Ironwood Electronics, Inc., 11351 Rupp Dr.,Suite 400, Burnsville, MN 55337
800-404-0204 or 952-229-8200 fax: 651-452-8400 E-mail: email@example.com Web:
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