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SMTA Packaging Symposium
Edina, MN — The SMTA's Spring Packaging Symposium — 3D/SiP Advanced Packaging Symposium — will be held April 28-30 at the Washington Duke Inn & Golf Club in Research Triangle Park, NC. The symposium will cover a wide range of application opportunities assessing the market, technology and business implications of three dimensional assembly technologies at both the package and product levels.
Topical coverage runs the gamut from chip stacks and origami semiconductor packaging through package on package (PoP) board level assembly. Speakers review technical, business and intellectual property aspects of 3D packaging and assembly for products ranging from consumer and commercial to military and medical devices leading to a better understanding of potential matches between various 3D technologies and specific product applications.
For more information, contact: SMTA, 5200 Willson Rd., Suite 215, Edina, MN 55424 952-920-7682 fax: 952-926-1819 Web:
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