Save. Share. Connect.
Friday, May 26, 2017
VOLUME -23 NUMBER 5
Publication Date: 05/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: Test and Measurement
Product Preview: EDS
May 2008 Issue
Add Message Board
Datacon and Ablestik Enter Strategic Partnership
Trevose, PA — Datacon, a supplier of advanced packaging equipment, and Ablestik, a supplier of adhesives and specialty materials for semiconductor packaging and microassembly
applications, have joined forces to provide joint technological development and shared product evaluations and demonstrations to the marketplace — to strengthen technological leadership, especially in processes such as thin die and/or stacked die handling as well as other advanced epoxy processes.
The existing demo and laboratory sites of both partners — Datacon (Trevose, PA) and Ablestik (Rancho Dominguez, CA) will be open to both companies and their customers. In the process laboratories — located in the three most important continents for advanced packaging — processes tailored to the specific needs of the customers can now be developed, evaluated and demonstrated. This enormous process knowledge of the two companies is now available to the clients, which will result in faster time to market, higher yields and lower cost of ownership.
Contact: Datacon North America, Inc., 3150 Tremont Avenue, Trevose, PA 19053
215-791-7070 fax: 215-791-7074 E-Mail: firstname.lastname@example.org Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM