Thursday, May 25, 2017


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ASM Assembly Systems at the SMT Hybrid Packaging 2017:The smart SMT Factory has become reality at ASM


At SMT Hybrid Packaging 2017 ASM Assembly Systems proved that the Smart #1 SMT Factory is no longer a remote vision, but showed concrete implementation.

Munich, Germany - The topic smart factory dominated – as it did at Nepcon Shanghai and Apex in the USA – the SMT Hybrid Packaging 2017 (Nuremberg, May 16-18): exhibitors and visitors alike showed deep interest in integrated production concepts and Industry 4.0 buzzwords. Technology leader ASM Assembly Systems proved that the Smart #1 SMT Factory is no longer a remote vision, but showed concrete implementations.
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Koh Young Highlights Latest Technology at SMT Hybrid Packaging Show

Seoul, South Korea - 3D inspection technology leader Koh Young Technology showed off its latest technology developments, including the KSMART Solution, Koh Young’s own field-proven AI platform – IP (Intelligent Platform) at the recent SMT Hybrid Packaging 2017 Show in Nuremberg, Germany. The exhibit was timely in part because Koh Young has proven the excellence of KSMART in Germany, the industrial powerhouse where the “Industry 4.0” concept first emerged, according to Wolfgang Runte, Sales Manager of Koh Young Europe.

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Advanced Interconnections Signs Electronic Salesmasters Incorporated As Manufacturer’s Representative

WEST WARWICK, RI - Advanced Interconnections Corp. (AIC) is pleased to name Electronic Salesmasters Inc. (ESI), of Beachwood, Ohio, as its new Manufacturer’s Representative for the greater Ohio territory consisting of OH, MI, IN, KY, and western PA and the Florida territory including Puerto Rico.

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Europlacer Appoints Ste.Al.Tech in Italy

MERATE, ITALY - Blakell Europlacer is pleased to announce the appointment of Ste.Al.Tech Srl as its agent in Italy. The move further strengthens the company’s infrastructure in the region, adding to resources recently put in place with a direct Europlacer office in Italy extending its support into Slovenia, Serbia and Croatia.

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StratEdge Expands CMC Base Laminate Packages to Include High-Power GaN Transistors & MMIC Devices

Packages on display at IMS 2017, Booth #1926, Honolulu, Hawaii

SAN DIEGO, CA - StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces the expansion of its LL family of high-power laminate copper-moly-copper (CMC) base packages to include both gallium nitride (GaN) transistor and MMIC device packages and package assembly services.

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Fujipoly: Extremely Soft TIM Delivers 13 W/m°K Performance

CARTERET, NJ - Sarcon® PG80A from Fujipoly® is one of the industry’s softest and highest performing thermal gap filler pads.

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Schleuniger: SmartDetect – The New Option for Quality Assurance

SmartDetect is another new, innovative quality monitoring option from the Schleuniger product portfolio.

MANCHESTER, NH - SmartDetect is a highly innovative quality monitoring option for Schleuniger CrimpCenters. The sensor-controlled system monitors the complete stripping process in real time and detects any contact of the stripping blade with the conductor.

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Nordson ASYMTEK Receives Innovation and Vision Awards

Auto Dual Simultaneous System honored at NEPCON China

CARLSBAD, CA - Nordson ASYMTEK a Nordson company, a leader in dispensing, coating, and jetting technologies, received two prestigious awards for innovative technology during NEPCON China 2017: the Innovation Award from Electronics Manufacturing (EM) Asia in the category of Special Systems--Dispensing Systems and the VISION Award for Innovative Products & Services in Surface Mount from SMT China magazine in the Dispensing and Conformal Coating category.

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2018 International Electrostatic Discharge Workshop Call For Presentations

ROME, NY - EOS/ESD Association, Inc. is now soliciting presentation abstracts for the 12th annual International Electrostatic Discharge Workshop (IEW). The Workshop will be held May 14-18, 2018 at the Corsendonk Priory Hotel, Oud-Turnhout, Belgium.

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New Generation of Extraction and Filtration Systems for Medium Quantities of Gases, Vapors, and Dusts

LOEBAU, GERMANY - ULT AG has completely redesigned its ULT 200 product range and now introduces a new generation of extraction and filtration devices.

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Indium Corporation Expert to Present at China Semiconductor Packaging Test Symposium (CSPT) 2017
CLINTON, NY - Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test Symposium (CSPT) on June 21-23 in Jiangyin, China.

SEMI | FlexTech and CPEIA Announce Partnership at CPES2017
MILPITAS, CA - SEMI | FlexTech (; and the Canadian Printable Electronics Industry Association ( have signed a Memorandum of Understanding to support each other’s programs and drive the continued development and adoption of printable, flexible hybrid, and wearable electronics (PE and FHE).

Ventec: Thomas Michels to Speak at the EIPC Summer Conference
SUZHOU, CHINA - Ventec's European Managing Director Thomas Michels will speak at EIPC Summer Conference on June 1st & 2nd, 2017 to be held at the Best Western Plus Manor Hotel, Solihull, UK.

Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR
NASHVILLE, TN - KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum.


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