Tuesday, January 24, 2017
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Digi-Key: Texas Instruments TPS2660x Industrial eFuses
Publication Date: 1/23/2017

ASCENTECH, LLC Exhibiting Contamination Testing and Optical Inspection Solutions at IPC/APEX 2017
Publication Date: 1/23/2017

CHESTER, CT- Ascentech, LLC, the North American distributor for GEN3 Systems products and other quality lines of test and productivity solutions, will be exhibiting the latest innovative contamination testing, optical inspection, and other productivity-enhancing technology at IPC/APEX in San Diego. Ascentech will show the remarkable GEN3 CM22+, one of the company’s award-winning CM+ range of contaminometers.
Microscan Demonstrates One Imaging Device for all Automation Needs at SLAS 2017
Publication Date: 1/20/2017

RENTON, WA - Microscan, the number-one brand of embedded clinical barcode readers and leading innovator of machine vision solutions for the life sciences, announces that it will demonstrate the MicroHAWK® family of barcode readers – the world’s smallest enclosed imaging devices for barcode reading and machine vision for clinical instruments – from Booth #1246 at the  Society for Laboratory Automation & Screening (SLAS) Annual Conference and Exhibition, scheduled to take place February 6-8 at the Walter E. Washington Convention Center in Washington D.C., U.S.A.
TopLine Awarded Exclusive Particle Damping Technology Transfer by NASA; More at IPC/APEX EXPO 2017
Publication Date: 1/20/2017

MILLEDGEVILLE, GA - Topline, a leading designer, manufacturer, and provider of electronic components and packaging solutions for PCB assemblies, has been granted an exclusive worldwide license by NASA for “Particle Damping for Vibration Mitigation for Circuit Cards.” The NASA invention U.S. Patent Application Serial No. 14/196,203 describes a ‘Vibration Damping Device for Circuit Card Assemblies.’ The invention pertains to the use of PID - Particle Impact Dampers, to attenuate destructive vibrations in PCB assemblies. Usage includes PCB assemblies in all fields.
Polyonics ESD-Safe Tapes Help Eliminate Static Charges
Publication Date: 1/20/2017

WESTMORELAND, NH - With upwards of 10% of electronics production failing due to static charges, some arising from process required insulators (e.g. masking tapes), more and more ESD control plans call for antistatic tapes.

Polyonics ESD-Safe™ polyimide tapes protect static sensitive components from ESD. The tapes comply with the low charging and static dissipative requirements of ANSI/ ESD S20.20, IEC 61340 and JEDEC JESD 625B, produce less than 100 volts with liner removal—and again when removed post process—and include static dissipative top surfaces with surface resistances of >10^5 and < 10^9 Ohms.
Mouser Now Offering Easy Product Search by Images
Publication Date: 1/20/2017

MANSFIELD, TX - Mouser Electronics, Inc., constantly improving how customers can browse and search for products, announces a new way to visually find and select the right products on its industry-leading website, Mouser.com. With a few simple clicks, Mouser customers can now find product information via Images, as well as by Datasheets or by Newest Products — in addition to searching for products through the site’s parametric Product Search.
Cicoil: Filler-Free Flat Ethernet Cables
Publication Date: 1/20/2017

Valencia, CA  For Ethernet applications that require flexible and lightweight cable designs, Cicoil offers filler-free, Cat 5e and Cat 6A Ethernet Cables.  These flexible flat cables don’t require cumbersome insulating materials, fillers, talc and tapes, which results in a more lightweight, flexible and space-saving cable design.

Ironwood Electronics: Users can socket their 452 ball 1.27mm pitch IC's with socket whose footprint same as IC footprint
Publication Date: 1/19/2017

EAGAN, MN - Ironwood Electronics' new high performance socket adapter - SF-BGA452A-B-32F allows 1.27mm pitch, 35x35mm body, 26X26 array IC to be placed in socket and operated without compromising electrical performance.

The Giga-snaP™ BGA socket adapter pair consists of SF-BGA452A-B-32F, patented female BGA sockets with machined pins epoxy over molded into an assembly that matches the male pin LS-BGA452A-31 adapter.
IBL to Introduce New Premium Vacuum Vapor Phase Soldering Systems
Publication Date: 1/19/2017

BURNSVILLE, MN - IBL Technologies, LLC today announced plans to introduce the new VAC745 and VAC765. The new premium vapor phase soldering machines will be displayed for the first time in Booth #1237 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif.
Alpha to Feature New Solder Paste & Preform Innovations for Low Voiding at IPC APEX
Publication Date: 1/19/2017

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will introduce several new product innovations at the upcoming IPC APEX Expo in San Diego that will soon be coming to market.
LEMO Announces a NEW Elbow Plug Connector Series to Help Manage Clutter
Publication Date: 1/19/2017

ROHNERT PARK, CA - LEMO, a global leader in the design and manufacture of precision custom connection solutions has recently introduced their new elbow plug connector, the Anglissimo™. The name Anglissimo™ is derived from the Italian language for ‘best angle’. This patent pending connector allows the customer to position the cable exit angle in one of eight possible positions during assembly. The solution is ideal in designs where many cables need to be positioned in a precise way to manage cable clutter.
FRAMOS Image Processing Solutions: Ensuring Quality and Monitoring Production in Photonics
Publication Date: 1/19/2017

ONTARIO, CANADA - With a deep knowledge from imaging sensors to vision systems, global imaging provider FRAMOS will showcase its innovative portfolio of image processing components, system solutions and related engineering services for measuring and testing technology, industrial engineering, optics, medical technology and electronics at:
Rehm presents innovations at IPC APEX EXPO
Publication Date: 1/18/2017

BLAUBEUREN, GERMANY - “Turn toward the future” – IPC APEX EXPO invites specialist visitors to San Diego, California from 14 to 16 February 2017 under this banner. Rehm Thermal Systems is once again present at this major electronics trade fair this year, and presents its latest plant technology for reliable reflow convection and condensation soldering at booth 1901
HARTING & Heilind Electronics Announce Partnership
Publication Date: 1/18/2017

ELGIN, IL - HARTING Americas and Heilind Electronics announced a distribution agreement today at Heilind’s headquarters in Wilmington, MA.

Both companies expressed their excitement with the agreement and their expectations for the future. HARTING will provide Heilind’s customers with its world-class connectivity solutions. Heilind will, in turn, increase HARTING’s growth even more through their online sales and industry presence.
Dr. Mike Bixenman Selected for Best of Conference Award for BTC/QFN Research Presented during SMTAI
Publication Date: 1/18/2017

NASHVILLE — January 17, 2017 — KYZEN is pleased to announce that one of Dr. Mike Bixenman’s papers that was presented during SMTA International 2016 has been selected by the SMTA for a Best Paper Award. Dr. Bixenman won the Rich Freiberger Best of Conference Award for his presentation entitled “BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes.” Bixenman co-authored the paper with Mark McMeen and Jason Tynes from STI Electronics.
Scienscope Growth Leads to New Representative in India
Publication Date: 1/18/2017

CHINO, CA - Scienscope International, a complete inspection solutions provider, today announced the appointment of Kyoritsu Electric India Pvt. Ltd. as its manufacturers’ representative in India. Kyoritsu was established in 2008 as a subsidiary of its parent company Kyoritsu Electric Corporation & Kyoritsu Test System (Japan) for marketing, sales and after sales support of their state-of-the-art PCBA in-circuit testers and function testers manufactured in Japan.
ATEC Business Development Manager Elected Chairperson of San Diego Section of IEEE
Publication Date: 1/18/2017

SAN DIEGO, CA - Gabe Alcala, Business Development Manager at Advanced Test Equipment Rentals (ATEC), has just been elected Chairperson of the San Diego Section of IEEE, the world's largest technical professional organization. Alcala has been an IEEE member for four years. This is his first year holding the office of Section Chairperson.
Eunil to Exhibit at IPC APEX EXPO in San Diego
Publication Date: 1/18/2017

CHULA VISTA, CA - Eunil, a worldwide leader in factory automation as a manufacturer of SMT peripheral equipment, will exhibit in Booth #101 at the upcoming IPC APEX Expo, scheduled to take place February 14-16 in San Diego, Calif. Eunil will exhibit its ELM-800 Laser Marker, ECM-1100 Coating Master, conveyors, and buffers.
CyberOptics Advances Breakthrough Multi-Reflection Suppression (MRS) Sensor Technology to an Even Higher Resolution
Publication Date: 1/18/2017

MINNEAPOLIS, MN - CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will unveil an advanced Ultra-High Resolution Multi-Reflection Suppression (MRS) sensor for the CyberOptics’ SQ3000™ 3D AOI system in Booth #2809 at the 2017 IPC APEX EXPO, February 14-16, 2017 at the San Diego Convention Center in California.

Breaking News: Nordson Corporation acquires ACE Production Technologies, Inc.
Publication Date: 1/17/2017

Spokane Valley, Washington ACE Production Technologies, Inc., a leading supplier of selective soldering systems, is pleased to announce that Nordson Corporation (NASDAQ: NDSN) has acquired ACE Production Technologies, Inc.

Founded in 2005 and employing a staff of approximately 50 people, ACE will operate as a new line of business within Nordson’s Advanced Technology Systems segment.  The engineering and manufacturing operations together with the customer support function of ACE will remain in Spokane Valley, Washington and will report to Peter Bierhuis, Vice President – Nordson Advanced Technology, Process Systems.
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