Wednesday, March 1, 2017
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Komax Systems Is Offering a Channel Mixer That Is Designed for New Water Treatment Methods
Publication Date: 3/1/2017

HUNTINGTON BEACH, CA - The water treatment needs of today's society are rapidly changing, and Komax is working to meet that change with a unique Channel Mixer design created for today's municipalities and organizations.
Nordson YESTECH Launch Advanced New FX-942 In-Line Dual-Sided Optical Inspection System at APEX 2017
Publication Date: 2/27/2017

CARLSBAD, CA - Nordson YESTECH, a subsidiary of Nordson Corporation and a leading supplier of automated optical and conformal coat inspection systems for the electronics industry launched their latest innovation, the FX-942 Dual-Sided Optical Inspection System, at the IPC APEX exhibition held in San Diego USA 14th – 16th February 2017.
Comtree to Represent Ersa’s Rework and Selective Solder Equipment at EPTECH Edmonton
Publication Date: 2/27/2017

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that it will exhibit with Comtree at EPTECH Edmonton, scheduled to take place Tuesday, March 7, 2017 at the Doubletree by Hilton in Edmonton, AB.
Linear Technology SmartMesh IP wireless sensor networks | Digi-Key Daily
Publication Date: 2/27/2017

Tom Tattersal of MicroCare at APEX 2017
Publication Date: 2/27/2017

New Rapid Dual Thermal Defect Detection & Component / Solder-Joint Validation from PDR Americas
Publication Date: 2/27/2017

SHINGLE SPRINGS, CA - PDR, a leader in IR rework, test and inspection, is pleased to introduce the new PDR IR-TS Series of micro-focused HALT/HASS thermal test systems.
YAMAHA Wins Coveted NPI New Product Award at APEX 2017 for Revolutionary Z:TA-R / YSM40R Modular Surface Mounter
Publication Date: 2/24/2017

SAN DIEGO, CA - Yamaha Motor Corporation, USA won a coveted New Product Introduction (NPI) Award for the company’s new ultra‐high‐speed Z:TA-R / YSM40R modular surface mounter, which boasts the world’s fastest placement rates and area productivity at 200,000 CPH.
Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications
Publication Date: 2/24/2017

IRVINE, CA - Henkel’s market leadership in solder materials development continues with the commercial launch of LOCTITE HF 2W, a tin-lead, water-washable solder paste designed for high-throughput, high-yield production.
Ersa to Attend the SMTA Houston/Dallas Expo & Tech Forums
Publication Date: 2/24/2017

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, today announced plans exhibit at the SMTA Houston & Dallas Expo and Tech Forums.
PI: E-754 Nanopositioning Controller for Piezo Stages Provides Higher Resolution
Publication Date: 2/24/2017

AUBURN, MA - Once again, PI has improved upon its best in class with a new reference-class digital controller / driver offering higher bandwidth and resolution, along with 3 times the driver power of its predecessor.
Networked 3D Inspection from Viscom at DELTEC
Publication Date: 2/24/2017

HANOVER, GERMANY - For solder paste inspection (SPI), automatic optical inspection (AOI) and automatic and manual X-ray inspection (AXI/MXI) technologies, DELTEC Automotive GmbH & Co. KG in Furth im Wald, Bavaria, Germany, relies on 3D systems from Viscom AG.
EPLAN Virtual Engineering Fair returns March 21
Publication Date: 2/23/2017

SCHAUMBURG, IL - EPLAN’s digital engineering fair is back bigger and better, providing the global engineering community with a 12-hour window on Tuesday, March 21 to watch live presentations and consult with specialists about EPLAN software solutions.
PSMA to Offer APEC Industry Session on Isolation Barrier Technologies
Publication Date: 2/23/2017

MENDHAM, N.J. - At APEC 2017, the Power Sources Manufacturers Association (PSMA) Safety & Compliance Technical Committee will hold the Industry Session: “Isolation Barrier Technologies.” Offering speaker presentations by six industry experts, Session IS14, will take place on Thurs., March 30th, from 8:30 a.m. to 11:30 a.m. at the Tampa Convention Center.
Vi TECHNOLOGY Will Discuss Innovative Process Improvement Software for Smart Factories at ENOVA STRASBOURG
Publication Date: 2/23/2017

SAINT-EGREVE, FRANCE - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit in Booth D22 at ENOVA STRASBOURG, scheduled to take place March 15-16, 2017 at the Parc des Exposition in France.
Industry 4.0 in real – FlexLink shows state of the art solutions at Interpack
Publication Date: 2/23/2017

GOTHENBURG, SWEDEN - The potential of Industry 4.0 lies in utilizing digitalization as a means to increase the effectiveness of manufacturing operations to new levels. At Interpack 2017, FlexLink exhibits new innovative solutions for leveraging production efficiency.
Torenko and Associates Celebrates 40 Years in Business
Publication Date: 2/23/2017

SUNNYVALE, TX - Torenko and Associates is pleased to announce its 40th year as a leading manufacturers’ representative organization. Since 1977, Ron Torenko and his team have specialized in the sales and marketing of premier electronic assembly equipment, production tools, test, repair, inspection and consumable products.
Viscom Awards Horizon Sales for Outstanding Sales Performance
Publication Date: 2/23/2017

 From left to right: Carsten Salewski, Dave Trail and Ed Mol
DULUTH, GA - Viscom today announced that it awarded Horizon Sales ‘2016 Representative of the Year’. Carsten Salewski, President and CEO of Viscom Inc., and Ed Moll, Viscom Inc.’s VP of Sales – Americas’, presented the award to Dave Trail, President of Horizon Sales, during the recent IPC APEX EXPO in San Diego.
Seika Recognizes Top Performing McDry Reps during APEX
Publication Date: 2/23/2017

TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce its top McDry representatives for 2016.
Dr. Nebioglu of Dymax Corporation Presented Her Research at the IPC/ APEX Expo
Publication Date: 2/22/2017

TORRINGTON, CT - Dymax Corporation is proud of the participation of its Senior R&D Manager of the Adhesives team, Dr. Aysegul Kascatan Nebioglu at the IPC/ APEX Expo 2017 that took place on February 14 to 17 in San Diego, California.
Indium Corporation’s Durham to Share Expertise at IMAPS Device Packaging
Publication Date: 2/22/2017

CLINTON, NY - Indium Corporation’s Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will share her expertise at IMAPS 13th International Conference and Exhibition on Device Packaging on March 7-9 in Fountain Hills, Ariz.
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