ROSEMONT, IL - The continuous drive for innovation within the electronics industry has accelerated the need to remain competitive and Aegis Software pride themselves on their original solutions to harness and deliver speed, control and visibility for manufacturing operations. Joining ScoopTalk as a key sponsor will allow Aegis the opportunity to join the debate which will focus on the influential trends that dominate the industry.

ATLANTA, GA ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that Ryan Curry, Technical Account Manager, will co-present a paper with Don Adams, Manufacturing Engineering Manager at Bose Corporation, during SMTA International. The presentation, “Understanding PCB Design and Material Warpage Challenges Which Occur during B2B/Module-Carrier Attachment,” is scheduled to take place during session APT7, “Package and PCB Interactions,” on Wednesday, September 28th at 4 p.m.

CHATSWORTH, CA – NEO Tech, a provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets, announced that its highly miniaturized electronic manufacturing capabilities are being deployed in advanced implantable devices and electroceuticals for the medial industry. 

NASHVILLE, TN — KYZEN has announced an new partnership with Stratus Technologies, a leader in surface preparation and a distributor of KYZEN specialty industrial cleaning products. 

As an active KYZEN partner, Stratus Technologies will promote, sell and support KYZEN’s full range of high-performance cleaning products throughout the United States – including Aqueous and Solvents chemistries and Corrosion Inhibitors. Additionally, Stratus Technologies will now draw on KYZEN’s technical resources in support.

Torrington, CT – Dymax Corporation has recently announced it has been awarded a new patent by the United States Patent and Trademark Office (USPTO). US Patent No. 9,394,436 entitled “Form-In-Place Gasket With Tack Free Surface” was received for a method for preparing a flexible, substantially tack free gasket by forming a liquid composition that would enclose displays, electronic circuits and similar components. 

Eindhoven, the Netherlands -  As one of the World’s leading suppliers of JTAG-powered testers and device programming tools, JTAG Technologies will display much of its current hardware range and will also offer live software demonstrations.  Experienced JTAG test engineers will be on-hand to discuss practical test issues and advise on solutions - just bring your questions and/or your target board to Booth 136 for an honest appraisal.