Chandler, AZ –  Not long ago, 2D inspection was the industry norm, but 3D inspection quickly proved itself as a more reliable technique. Today, true 3D measurement has become even more effective, especially when AI power analyzes the real data. But what is the difference between 3D inspection and 3D measurement, and how can AI improve your process?

Beltsville, MD – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that it is presenting, Initiatives for Addressing ISO-26262 Hardware Risk Assessments, at the 2018 Annual Automotive Electronics Council (AEC) Reliability Workshop on April 24 – 26 in Novi, Michigan. James McLeish and Ashok Alagappan, of the DfR Solutions Senior Technical Staff, will present with Senior Reliability/Test Engineer Keith M. Hodgson of Ford Motor Co. on Wednesday, April 25 from 4:00 PM to 5:30 PM.

TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced that all McDry cabinets will soon be able to maintain one percent RH levels with the new optimized drying units, like the McDry DXU-1001A UL Quick Dehumidifying Model. The McDry name is known for high performance, quality, and its market longevity.

Atkinson, NH— ­optical control GmbH & Co. KG, a world leader in automated component counting technology, today announced that it has signed on with Competitive Edge Solutions, LLC as its newest manufacturers’ representative. David Wilson will represent optical control throughout the six New England states (MA, CT, RI, VT, NH, ME). Competitive Edge Solutions has more than 20 years of practical experience in providing industry-leading equipment to exceed its customers’ needs.  

Milpitas, CA – SEMI today announced that it has signed a memorandum of understanding to integrate the ESD (Electronic System Design) Alliance as a SEMI Strategic Association Partner this year. Under the partnership, the Redwood City, Calif.-based association and its system design ecosystem membership will join SEMI, deepening ESD Alliance’s global reach in the electronics manufacturing supply chain and enabling SEMI members to connect and directly collaborate with the semiconductor design sector.  

Saint-Egrève, France — Vi TECHNOLOGY, a leading provider of 3D inspection solutions for PCB assembly and a member of Mycronic Group, today announced that its products will be showcased at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center.