Saturday, April 29, 2017
VOLUME -24 NUMBER 5
Publication Date: 05/1/2009
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Nordson DAGE Picks Up Its Third Award for the Quadra™ 7 X-ray

The new Quadra™ 7 receives a 2017 EM Asia Innovation Award

AYLESBURY, UK - Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), today announced that it has been awarded a 2017 EM Asia Innovation Award in the category of Test & Measurement/Inspection Systems – AXI for its Quadra™ 7.
 

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KYZEN Awarded for New Industry 4.0 Enabled KYZEN ANALYST™ at NEPCON China

NASHVILLE, TN - KYZEN is pleased to announce that it has been awarded a 2017 EM Asia Innovation Award in the category of Software – Process Control Systems for its KYZEN ANALYST™ Real-Time Concentration Monitoring & Reporting System.
 

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Hanwha Techwin Assembly Line Solutions for LED Big Board Applications

CYPRESS, CA - Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, commits to providing quality sales, service, and support of precision assembly line solutions configured for LED big board applications including PCB form factors of 1.2 and 1.5 meters in length.

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BTU’s New Dual Chamber Reflow System Awarded during NEPCON China 2017

NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, announced that it received a 2017 SMT China Vision Award in the category of Reflow – Soldering for the PYRAMAX™ ZeroTurn Dual Chamber system.
 

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PI: New Rotary Air Bearing Series Achieve High Precision in Any Orientation

With a max payload of 13 to 425kg and virtually unlimited life, PI’s RM series is a complete positioning solution based on in-house technology development and manufacturing.

AUBURN, MA - PI (Physik Instrumente), a leader in precision motion control solutions, announces the new A-62x PIglide series of rotary air bearing stages.

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Metcal’s Latest Innovation in Hand Soldering Receives Prestigious Industry Award during NEPCON China

CYPRESS, CA - Metcal today announced that it received a 2017 SMT China Vision Award in the category of Hand Soldering for the CV-5200 Connection Validation™ Soldering Station. The award was presented to the company on April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
 

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Avnet Assembles LED Design Dream Team for LIGHTFAIR Institute Courses

Interactive “digital sky” and IoT Greenhouse demonstrations on display at Avnet’s custom-built LFI pavilion

PHOENIX, AZ – Avnet, a leading global technology distributor, announced today that Avnet Illumineer Bob Householder will be among the featured course instructors at this year’s LIGHTFAIR® International (LFI®), May 7-8, 2017, at the Pennsylvania Convention Center, Philadelphia.
 

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Scienscope’s Automated Component Counter Wins an SMT China Vision Award

CHINO, CA - Scienscope International, a complete inspection solutions provider, is pleased to announce that it received a 2017 SMT China Vision Award in the category of Inspection – AXI for the AXC-800. The award was presented to the company on April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.

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DuPont Awarded Expanded Global Patents for Kapton® Matte Black Film and Coverlay

RESEARCH TRIANGLE PARK, N.C. - DuPont Electronics & Communications (DuPont) announced today that it has expanded its worldwide patent estate related to DuPont™ Kapton® black polyimide film, and DuPont™ Pyralux® black flexible circuit material, both sought after for applications such as mobile devices, computers, automotive and military electronics.


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Indium Corporation Expert to Present at InnovationsFORUM Hungary

CLINTON, NY - Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the InnovationsFORUM Hungary on May 25 in Budapest, Hungary.

Karthik will present Minimizing QFN Voiding During SMT Assembly.
 

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TopLine Exhibiting CCGA, Solder Joint Reliability Solutions at SMT/Hybrid/Packaging Nuremberg May 16-18

IRVINE, CA - TopLine will exhibit for the 20th straight year at SMT/Hybrid/Packaging Exhibition in Nuremberg, Germany, May 16 -18, 2017 in Stand #A4-120.

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HARTING Celebrates Its Trade Fair Anniversary With Convincing Innovations

ESPELKAMP/HANNOVER - The HARTING Technology Group will be presenting a number of technological highlights at its special anniversary at this year's HANNOVER MESSE industrial trade fair (24 – 28 April 2017, Hall 11, Stand C15).

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Nordson YESTECH Installs Advanced 3D AOI at the World’s Leading Supplier of Probe Cards

CARLSBAD, CA - Nordson YESTECH, a subsidiary of Nordson Corporation and a leading supplier of automated optical and conformal coat inspection systems for the electronics industry, recently installed a FX-940 ULTRA 3D AOI system at FormFactor, Inc. in Carlsbad.
 

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ULT: New Extraction and Filtration System Concept at SMT Hybrid Packaging 2017

LOEBAU, GERMANY - ULT AG, world-class vendor of air technology systems, will introduce a new extraction and filtration device generation at SMT Hybrid Packaging trade show in Nuremberg/Germany.

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SEMICON Southeast Asia Attendance Surges on Disruptive Technology: Industry Sharpens Interest in Innovation and Collaboration

PENANG, MALAYSIA - Today SEMI announced that SEMICON Southeast Asia 2017 (SEMICON SEA 2017) is reporting an increase of up to 30 percent in attendees this year. Over 7,500 visitors and exhibitors are expected from 25 to 27 April at the event, which is the region’s premier exposition for connecting the electronics manufacturing supply chain.

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MIRTEC TO EXHIBIT A NEW INSPECTION SYSTEM WITH THE PERFECT INSPECTION SOLUTION AT NEPCON CHINA 2017

OXFORD, CT - This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center.
 

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Alpha to co-exhibit with smartTec GmbH at the SMT Hybrid Packaging Exhibition in Nuremberg, Germany

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present its latest product innovations alongside smartTec GmbH its Premium Distributor for Germany and Central Europe at the SMT Hybrid Packaging Exhibition.

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SCS Presents at the SMTA Contamination, Cleaning and Coating Conference in Amsterdam

INDIANAPOLIS, IN - Specialty Coating Systems (SCS) is pleased to announce that it will exhibit and present during the SMTA Contamination, Cleaning and Coating Conference, scheduled to take place May 22-24, 2017, in Amsterdam.
 

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EPEC HIRES NEW USER INTERFACE PRODUCT MANAGER

New Bedford, MA With the latest enhancement in SMART Human-Machine Interface (HMI) technologies and to better assist customers’ needs, Epec recently announced the hiring of Steve Goodman, the new User Interface Product Manager.


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Recover Your Cost Savings with EVS and Microtronic at SMT Nuremberg

Isle of Wight, UK - EVS International, the leader in solder recovery, today announced plans to exhibit with its distributor – Microtronic – in HALLE 5 STAND 221J at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremberg, Germany. EVS will show the EVS 500LF Solder Recovery System. With the new concept of improved performance plus the significant reduction in price, everyone can enjoy the savings that EVS solder recovery systems can offer.
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