Friday, September 30, 2016
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Acculogic to Hold Open House in Orlando, FL
Publication Date: 9/29/2016

Markham, ON - Acculogic Inc., a global leader in electronic production test solutions, announces that it will be hosting an open house October 5-6, 2016 in Lake Mary, FL.

The open house is an event for individuals who are interested in or, are looking for circuit board test solutions that will improve product quality, time to market, leverage the use of their existing test equipment or, save on product quality expenditure.
Horizon Sales Receives Its Fourth Consecutive Global Technology Award during SMTAI
Publication Date: 9/29/2016

HOWELL, MI - Horizon Sales announces that it was awarded a 2016 Global Technology Award in the category of Best Manufacturers’ Representative for the Americas. The award was presented to the company during a Tuesday, Sept. 27, 2016 ceremony that took place at the Donald Stephens Convention Center in Rosemont, IL during SMTA International. Horizon Sales is a leading manufacturers’ representative corporation, specializing in the sales and marketing of premier electronics assembly equipment. This year marks Horizon Sales fourth consecutive year earning the award in its category.

The ELM-800 Laser Marker by Eunil Wins Best Product – Asia at SMTAI
Publication Date: 9/28/2016

CHULA VISTA, CA - Eunil, a worldwide leader in factory automation as a manufacturer of SMT peripheral equipment, announces that it was awarded a 2016 Global Technology Award in the category of Best Product – Asia for its ELM-800 Laser Marker. The award was presented to the company during a Tuesday, Sept. 27, 2016 ceremony that took place at the Donald Stephens Convention Center in Rosemont, IL during SMTA International.

Ersa Wins the Global Technology Award for Its Selective Soldering Capabilities
Publication Date: 9/28/2016

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, today announced that it was awarded a 2016 Global Technology Award in the category of Soldering – Selective for its VERSAFLEX-Ultra.
MIRTEC Wins 10th Global Technology Award for 3D SPI Inspection Technology
Publication Date: 9/28/2016

OXFORD, CT - MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2016 Global Technology Award in the category of Inspection – SPI for its MS-11e 3D SPI Machine. The award was presented to the company during a Tuesday, Sept. 27, 2016 ceremony that took place at the Donald Stephens Convention Center in Rosemont, IL during SMTA International.

Nordson Honored with SMTA Corporate Partnership Award
Publication Date: 9/28/2016

Westlake, OH- Nordson Corporation has received the SMTA Corporate Partnership award in recognition of its ongoing support of the Surface Mount Technology Association (SMTA). Several businesses within Nordson's Advanced Technology-Electronics Systems group are active Corporate members, including Nordson ASYMTEK, Nordson DAGE, and Nordson YESTECH. Nordson ASYMTEK's corporate membership dates back to 1989, before its acquisition by Nordson Corporation.
Alpha to Feature New Product Innovations at SMTA Austin Expo
Publication Date: 9/27/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will feature material set combinations to include paste, tacky flux, cored wire and wave soldering flux that are tested with one another to achieve greater reliability at the SMTA Austin Expo to be held October 11th at the Norris Conference Center in Austin, Texas.
TE Connectivity: New High Speed Cables Offer Signal Integrity in IEEE 1394 Applications
Publication Date: 9/27/2016

HARRISBURG, PA - TE Connectivity Ltd. (TE) (NYSE: TEL), a world leader in connectivity and sensors, announced today that its new Raychem high-speed data transmission cables for IEEE 1394 applications. Designed for use with military ground, military and commercial aerospace and marine systems, the ruggedized cable helps block out excess noise in harsh environments to enable dependable signal integrity in extreme conditions.
Now Available from HEIDENHAIN: Absolute Linear Encoders with Panasonic Interface
Publication Date: 9/27/2016

SCHAUMBURG, IL - HEIDENHAIN CORPORATION is pleased to announce the start of series production of the new generation of LC encoders. The LC xx5 Absolute Sealed Linear Encoders have long been available for use with Siemens, Fanuc, Mitsubishi, and HEIDENHAIN controls – and can now be ordered with Panasonic interface (Pana01).

Avnet to Launch Directory at N.Y. World Maker Faire
Publication Date: 9/27/2016

PHOENIX, AZ - Avnet, Inc. (NYSE: AVT), a leading global technology distributor, today announced that it will launch its new MakerSource.ioTM online resource directory at the N.Y. World Maker Faire in the New York Hall of Science, Corona, N.Y., Oct. 1-2, 2016.
Hover-Davis Announces Its New SA Series Automation Feeders at the SMTAi Exhibition
Publication Date: 9/27/2016

ROSEMONT, IL - Known as The Feeder Company, Hover-Davis announces the introduction of its new SA Series automation feeders in Booth #807 at the SMTA International 2016 Exhibition in Rosemont, IL, on September 27–28.

New SA Series automation feeders utilize the company’s proven SSF feeder technology and architecture to enable a wider range of interface and control capabilities, including an advanced ASCII communication protocol, lower profile form-factor and a host of interface modules for simple drop-in integration.
Vi TECHNOLOGY premieres complete 3D solutions at MATELEC with PI, the most innovative SPI system
Publication Date: 9/26/2016

Saint-Egrève, France - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit with Fenwick Iberica in Booth 5D12 at MATELEC, schedule to take place October 25-28, 2016 in Madrid, Spain. Vi TECHNOLOGY will showcase its award-winning PI series 3D SPI.
Metcal: New Solder Wire Feeder Adds a New Level of Control – Find Out More at SMTA Guadalajara
Publication Date: 9/26/2016

CYPRESS, CA - Metcal today announced plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 5-6, 2016 at Hotel Riu Guadalajara. Company representatives will show the Metcal USF-1000 Solder Wire Feeder, along with Metcal’s proven rework and repair equipment, including the Scorpion Rework System and MX-5200 Soldering System.
YXLON CT goes VGStudio MAX 3.0
Publication Date: 9/26/2016

 CT metrology analyses of an aluminum pump housing using VGStudio MAX 3.0
HAMBURG, GERMANY - Effective immediately, all computed tomography systems from YXLON International will be delivered including the VGStudio MAX 3.0 visualization and analysis software family. According to the manufacturer, Volume Graphics, the software has been redeveloped from scratch. By directly implementing VGStudio MAX 3.0 and the add-on modules for special areas of application, YXLON customers profit right away from the numerous improvements and enhancements.
Digi-Key: Linear Technology LTC7149
Publication Date: 9/26/2016

PI: White Paper Explains Design and Preparation of NanoPositioners for High Vacuum
Publication Date: 9/26/2016

AUBURN, MA - For decades, PI has provided stages and systems for vacuum levels from 10-3 mbar to 10-9 mbar that deliver reliable motion control for positioning and alignment.

Aegis Joins New Thought-Leadership Program ‘ScoopTalk’ at SMTA International
Publication Date: 9/23/2016

ROSEMONT, IL - The continuous drive for innovation within the electronics industry has accelerated the need to remain competitive and Aegis Software pride themselves on their original solutions to harness and deliver speed, control and visibility for manufacturing operations. Joining ScoopTalk as a key sponsor will allow Aegis the opportunity to join the debate which will focus on the influential trends that dominate the industry.

Understanding PCB Design & Material Warpage Challenges – Learn More at SMTAI from Akrometrix
Publication Date: 9/23/2016

ATLANTA, GAAkrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that Ryan Curry, Technical Account Manager, will co-present a paper with Don Adams, Manufacturing Engineering Manager at Bose Corporation, during SMTA International. The presentation, “Understanding PCB Design and Material Warpage Challenges Which Occur during B2B/Module-Carrier Attachment,” is scheduled to take place during session APT7, “Package and PCB Interactions,” on Wednesday, September 28th at 4 p.m.

NEO Tech Offers Microelectronics Miniaturization for Medical Implantable Device OEMs
Publication Date: 9/23/2016

CHATSWORTH, CANEO Tech, a provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets, announced that its highly miniaturized electronic manufacturing capabilities are being deployed in advanced implantable devices and electroceuticals for the medial industry. 

SEHO’s PowerWave N2 Tunnel Design Ensures High Energy Efficiency
Publication Date: 9/23/2016

Kreuzwertheim, Germany - SEHO Systems GmbH, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, will exhibit in Booth 5B05-5B03 with its representative for Spain and Portugal, Propelec S.A., at MATELEC, scheduled to take place Oct 25-28, 2016 in Madrid, Spain. The PowerWave N2, equipped with a closed tunnel system, will be on display at the show.

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