Tuesday, August 30, 2016
VOLUME -26 NUMBER 12
Publication Date: 12/1/2011
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Boundaries are shattered as Glide-Line™ Introduces the new Glide-Line™ 360 which allows limitless creativity for product handling in minimal space.
Publication Date: 8/26/2016

SOUDERTON, PA - Glide-Line™, manufacturer of the most versatile multi-strand panel and pallet-handling conveyor solution available for the industry, introduces Glide-Line 360.

“As a provider of mechanical hardware solutions, item North America/MB Kit Systems Inc. sees multiple requests for complex material handling solutions.


Metcal: New Solder Wire Feeder at NEPCON South China
Publication Date: 8/26/2016

GARDEN GROVE, CA - Metcal today announced plans to exhibit in Booth #1H55 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center. Company representatives will show the Metcal USF-1000 Solder Wire Feeder, along with Metcal’s proven rework and repair equipment, including the Scarab Site Cleaning System, Scorpion Rework System, MX-5200 Soldering System and more. The new Metcal USF-1000 Solder Wire Feeder adds a new level of control and convenience to the soldering process.
JUKI Automation Systems and ETEK Europe Bundle Their Competencies
Publication Date: 8/26/2016

 
 
NUREMBERG, GERMANY - JUKI Automation Systems, a worldwide leading supplier of SMT placement systems and production solutions, and ETEK Europe Ltd. bundle their competencies in order to strengthen their local presence in the markets of the United Kingdom and Ireland, and to further expand their common growth potentials.


BTU: Register Today for the Solder Reflow Fundamentals Workshop during SMTAI
Publication Date: 8/26/2016

NORTH BILLERICA, MA -BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, announces that Fred Dimock, Manager of Process Technology, will conduct a reflow workshop during SMTA International at the Donald Stephens Convention Center in Rosemont, IL. The workshop, entitled “Solder Reflow Fundamentals – Understanding and Obtaining Profiles,” is scheduled to take place Sunday, September 25 at 8:30 a.m. CDT in room 52.
Techcon Systems to Show New Hot Melt Jet Valve at NEPCON South China
Publication Date: 8/25/2016

GARDEN GROVE, CA - Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, will exhibit in Booth # 1H55 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center. Company representatives will showcase the new TS9300HM Hot Melt Jet Valve as well as Techcon Systems’ lineup of industry-leading valves.
Saki Demonstrates 3D AOI Systems at NEPCON South China, Booth 1G35
Publication Date: 8/25/2016

FREMONT, CA - Saki Corporation, an innovator in the field of automated optical inspection equipment, will demonstrate its 2D and 3D automated optical inspection (AOI) systems at NEPCON South China in booth 1G35. Saki's AOI systems' unique Phase Measurement Profilometry technology and quad-directional side cameras inspect and measure QFNs, J-leads, and connectors, and enable the detection of the most difficult defects, such as lifted leads, tombstones, reverses, and height variations, without a reduction in speed.
Viscom Remains a Strategic Supplier to Continental in the Automatic Optical Inspection Area
Publication Date: 8/24/2016

HANOVER, GERMANY - Viscom AG has successfully proven itself in a benchmark for automatic optical inspection (AOI) and remains the preferred supplier to the Automotive Group of the Continental Corporation for the important printed circuit board inspection area.
Nano Dimension Supplies First DragonFly 2020 System to Leading Israeli Defense Company
Publication Date: 8/24/2016

NESS ZIONA, ISRAEL - Nano Dimension Ltd., a leader in the field of 3D Printed Electronics (NASDAQ, TASE: NNDM), announced today that its wholly owned subsidiary, Nano Dimension Technologies, has supplied the first DragonFly 2020 system designated for 3D circuitry and PCBs. The supply was made to a leading defense company in Israel for evaluation purposes and is expected to be installed at the partner’s site in the coming days.

Seika’s Michelle Ogihara to Co-Chair the Moisture-Sensitive Device Council Meeting at SMTAI
Publication Date: 8/24/2016

TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that Michelle Ogihara, Senior Sales Manager, will co-chair the Moisture Sensitive Device (MSD) Council meeting during the upcoming SMTA International Conference & Exhibition. The meeting is scheduled to take place Tuesday, September 27, 2016 at 3 p.m. in room #60 in the conference area. The council welcomes all interested parties seeking solutions to their MSD issues to come with questions.
Alpha to Feature No-Clean, Lead-Free Touch-Up Kit at Upcoming SMTA International
Publication Date: 8/24/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is going to feature its no-clean, lead-free material set combination for touch-up operations at the SMTA International exhibition, taking place September 27th-28th in Rosemont, Illinois.

Dymax: Easily Removable Electronic Mask Cures in Seconds to Maximize Production Speed
Publication Date: 8/24/2016

TORRINGTON, CT - Dymax Corporation recently launched maskant SpeedMask® 9-20479-B-Rev-A- a blue, light-curable peelable maskant for PWB connectors and board level protection. This SpeedMask resin is designed for protection of electronic components and assemblies, provides protection from reflow or wave soldering operations, and shields keep-out areas during conformal coating applications.
ASTEELFLASH in the Top 20 Manufacturers of the Bay Area by San Francisco Business Times
Publication Date: 8/24/2016

FREMONT, CA - Asteelflash has been ranked among the top 20 Manufacturers of the Silicon Valley / Bay Area by the San Francisco Business Times.
CyberOptics: Maximize Yields with MRS-Enabled SQ3000 3D AOI Featured at SMTAI
Publication Date: 8/24/2016

MINNEAPOLIS, MN - CyberOptics® Corporation (NASDAQ: CYBE) today announced plans to exhibit in Booth #1021 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. The SQ3000™ 3D Automated Optical Inspection (AOI) system, deemed best-in-class, will be on display for live demonstrations.
Sensoray: USB 3.0 Video Capture in SDI or DVI
Publication Date: 8/23/2016

TIGARD, OR - Sensoray introduces its new Model’s 3364 a USB 3.0 device available in SDI or DVI versions. It captures uncompressed SD/HD video in resolutions up to 1080p60 and uses H.264 video compression for inputs up to 1080p30, both with very low latency. A USB 3.0 device, it is capable of capturing uncompressed video at full frame rates and simultaneously sending uncompressed (preview) and compressed streams to the host.
Keystone Electronics: Color Coded, Auto Blade Fuse Holders
Publication Date: 8/23/2016

ASTORIA, NY - Identifying Automotive Blade Fuses on PCBs is now “quick and simple” with the colored insulator bodies now available as the latest addition to Keystone Electronics highly-regarded series of low insertion force, compact Auto Blade Fuse Holders.

Rated for 20 AMPs, 500VAC continuous usage, these new holders are available in Surface Mount (SMT) and Thru-Hole (THM) types.
Panasonic Launches New PanaCIM Maintenance for Asset Management
Publication Date: 8/23/2016

ROLLING MEADOWS, IL - Panasonic Factory Solutions Company of America has launched a new PanaCIM® Maintenance solution to control the full life cycle of any manufacturing asset. PanaCIM Maintenance brings innovative, value-added elements to help manufacturers streamline processes, reduce costs, increase uptime, and improve efficiencies.
Indium Corporation Technology Expert to Present at IMAPS ATW on Advances in Semiconductor Packaging
Publication Date: 8/23/2016

CLINTON, NY - Indium Corporation's Maria Durham will present at IMAPS’ Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging Sept. 22 at SUNY Polytechnic Institute in Utica, N.Y.
 

NEO Tech Ranks on the Inc. 5000, Inc. Magazine’s 35th Annual List of America’s Fastest-Growing Private Companies
Publication Date: 8/23/2016

CHATSWORTH, CA - NEO Tech, a leading provider of microelectronics, engineering and manufacturing services, and supply chain solutions for brand name OEMs in the industrial, medical and military/aerospace markets, announces that it placed on Inc. magazine’s 35th annual Inc. 5000, the most prestigious ranking of the nation’s fastest-growing private companies.
SHENMAO Exhibits at SEMICON TAIWAN on September 7-9, 2016 Booth # J2922 Featuring BGA Solder Spheres and Bumping Paste
Publication Date: 8/23/2016

SAN JOSE, CA - SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.
Vi Technology: 3D SPI with Unambiguous Z Referencing and Warpage Compensation
Publication Date: 8/23/2016

SAINT-EGREVE, FRANCE - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit with AXIS AUTOMATION in Hall 3 – Booth 3141 at ELECTRONICA India, scheduled to take place September 21-23, 2016 at the BIEC- Bangalore International Exhibition Center. Vi TECHNOLOGY will showcase its award-winning PI series 3D SPI.
 
 
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