Monday, January 16, 2017
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Scienscope Offers the Best Performance to Price Ratio – Get a Live Demo on the X-Scope 3000 at MD&M West
Publication Date: 1/13/2017

CHINO, CA - Scienscope International, a complete inspection solutions provider, will exhibit in Booth #2887 at MD&M West, scheduled to take place Feb. 7-9, 2017 at the Anaheim Convention Center in CA. The Scienscope team will demonstrate the X-Scope 3000 X-ray system.
Multitest: Relying on Leading Test Handling Know-How, Rapid Acceptance of the New MT2168 XT Handler by the Market
Publication Date: 1/13/2017

ROSENHEIM, GERMANY - Multitest has received multiple orders for the new tri-temp pick and place handler, the MT2168 XT. Shortly after its official introduction to the market four global IDMs have chosen the MT2168 XT for their volume production.

After comprehensive demos or onsite evaluations customers have chosen the MT2168 XT because of its temperature performance, high multisite capabilities, flexibility, and small floor space requirements.
 
Worldwide Business with kathy ireland® Interviews HARTING to Discuss Manufacturing Trends in North America and the Future of Connectivity
Publication Date: 1/12/2017

 
 HARTING Americas President & CEO, Jon DeSouza, appearing on the set of Worldwide Business with kathy ireland® 

Elgin, ILHARTING AmericasPresident and CEO, Jon DeSouza is featured on the award-winning, global TV show, Worldwide Business with kathy ireland®. The segment’s topic is trends in manufacturing, such as reshoring and IoT, and how the company's durable, reliable connectivity products support these trends.

iTAC Smart Factory Solutions at IPC APEX 2017
Publication Date: 1/12/2017

MONTABAUR, GERMANY – iTAC Software AG announces it will feature its advanced planning and scheduling, business intelligence, and real-time factory dashboards in booth #2619 at the upcoming IPC APEX Expo, scheduled to take place February 14-16 in San Diego, CA.
DYCONEX Successfully Achieves EN 9100:2009 Certification
Publication Date: 1/12/2017

BASSERSDORF, SWITZERLAND - DYCONEX AG, an MST company and the world's leading supplier of highly complex solutions in the area of interconnect technology, has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.
Alpha to Feature Die Attach, High Temp Dip Tinning Technologies and Assembly Polymers at Internepcon Japan 2017
Publication Date: 1/12/2017

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, plans to feature a range of ALPHA® Products for Die Attach, High Temp Dip Tinning technologies and Assembly Polymers at the 2017 INTERNEPCON JAPAN show to be held in Tokyo from January 18th – 20th.
Saki Exhibits Smart Factory 3D AOI and SPI Systems at IPC APEX
Publication Date: 1/11/2017

FREMONT, CA - Saki Corporation, an innovator in the field of automated optical inspection equipment, will exhibit its 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems and their Smart Factory and Industry 4.0 capabilities at IPC APEX 2017, San Diego, CA, in booth 2909. Saki's inspection and measurement systems can be used to communicate with equipment in printed circuit board assembly lines to ensure that the PCBs are produced efficiently and adhere to the highest standards of quality and reliability.
Turn Any Storage Shelves or Racks into Intelligent Storage Locations with the New Inovaxe InoBar
Publication Date: 1/11/2017

DEERFIELD BEACH, FL - Inovaxe today announced plans to exhibit in Booth #2143 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in California. Inovaxe will introduce the newly designed InoBar and display the SR Series Smart Racks and InoAuto Smart Carts, storing 7 and 13 inch reels and mechanical bins. Inovaxe’s newly designed InoBar can turn nearly any storage shelves or racks into intelligent storage locations.
 
ECD Product Line Enhancements Underscore Continuous Improvement Philosophy
Publication Date: 1/11/2017

MILWAUKEE, OR - ECD has announced a series of upgrades and enhancements for its line of award-winning electronics manufacturing technologies, including new features for its SmartDRY™ Intelligent Dry Storage systems, M.O.L.E.® thermal profilers and OvenRIDER® NL2+ oven verification tool. All of these newly-upgraded products will be on display at the IPC APEX Expo in ECD booth # 2139.
Explore the New KYZEN ANALYST™ Real-Time Concentration Monitoring & Reporting System at APEX
Publication Date: 1/11/2017

NASHVILLE, TN - KYZEN today announced plans to exhibit in Booth #2401 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The KYZEN team is excited to demonstrate the new KYZEN ANALYST™ Real-Time Concentration Monitoring & Reporting System.
America II Adds Six Franchise Lines
Publication Date: 1/11/2017

ST. PETERSBURG, FL - America II Electronics, Inc., one of the world’s largest distributors of semiconductors and electronic components, today announced it has signed franchise distribution agreements with six manufacturers. The company added Jonhon, MynTahl, L-Com Global Connectivity, Kang Yang Hardware, Electronic Assembly, and Amtouch USA to its global line card.
VirTex – 2016 Reflection. 2017 Outlook
Publication Date: 1/11/2017

 
Brad Heath (right) VirTex CEO, and Rick Polansky (left) , Sr. VP Business Development
Austin, TX - For nearly twenty years, VirTex has experienced year-on-year growth.  Even through turbulent times, the company has remained profitable and financially stable.  As the industry looks forward to the a new year, we look back at VirTex's 2016 and forward to their 2017 projections. 
U.S. Tech Publisher's Choice: January 2017
Publication Date: 1/10/2017

Our Publisher's Choice article this month is a piece by Peter van den Eijnden of JTAG Technologies on developing and optimizing electronics test strategy entitled "Reducing the PCB Bone Pile: Optimizing Test Strategy." The benefits of a vigorous test strategy can far outweigh the cost of implementing it, contributing to greatly reduced waste and scrap.
Akrometrix to Showcase Next-Generation AXP Shadow Moiré System at APEX
Publication Date: 1/10/2017

ATLANTA, GA - Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, will exhibit in Booth #704 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The company will demonstrate its next-generation Shadow Moiré System – the AXP 2.0.
BTU to Introduce the PYRAMAX™ ZeroTurn Dual Chamber System at APEX
Publication Date: 1/10/2017

NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, today announced plans to make a major new product introduction at the 2017 IPC APEX EXPO, scheduled to take place February 14-16, 2017 at the San Diego Convention Center in California. BTU will introduce the PYRAMAX ZeroTurn Dual Chamber system in booth #835.
Essemtec Announces Placement & Jetting in a Single Pass Through with the New FOX2
Publication Date: 1/10/2017

GLASSBORO, NJ - Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced plans to exhibit in Booth #1223 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. Essemtec will debut the FOX² and demonstrate the compact Spider jet dispenser.
 
Epec Celebrating 65 Years of Manufacturing Excellence
Publication Date: 1/10/2017

NEW BEDFORD, MA - This January marks a major milestone for Epec, LLC as they celebrate 65 years of manufacturing excellence. As the oldest printed circuit board company in North America, Epec demonstrates why they are one of the top industry leaders in custom build to print electronics.
Cable widths up to M25 now compatible with HARTING Han® 3A connectors
Publication Date: 1/10/2017

ELGIN, IL - HARTING has expanded the choice of cables that customers can use in its Han® 3A size connectors

The Han® 3A now can be assembled with cable diameters as large as M25 instead of the previous limit of M20.
 
Innovative Machine Technology: SEHO Ensures Higher Productivity at APEX
Publication Date: 1/10/2017

ERLANGER, KY - SEHO North America, Inc., a worldwide leading supplier of complete solutions for soldering processes and automated production lines, will highlight a full line of market leading selective soldering and wave soldering systems in Booth #2309 at the IPC APEX EXPO, scheduled to take place Feb. 14 – 16, 2017 at the San Diego Convention Center.
 
Ventec’s Martin Cotton to unveil industry's most advanced Ultra-Low Dk PCB Materials for High-Speed Low-Loss Applications at DesignCon 2017
Publication Date: 1/10/2017

Fullerton, CA - Ventec International will be participating at DesignCon 2017, the premier conference for chip, board, and systems design engineers, on booth #118 and has specifically chosen the event as the ideal platform to unveil the industry's latest advances in PCB materials for high-speed low-loss applications. Ventec's Martin Cotton (Director - OEM Technology Marketing) and Bill Wang (Technical Director) will be presenting their paper titled "Ultra-Low Dk PCB Materials for High-Speed Low-Loss Applications" in Ballroom F on Wednesday, 1st February at 8:00am.

 
 
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