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A New Approach To Component Stacking Publication Date: 2/9/2009 By Keith Gurnett and Tom Adams One of the most innovative concepts in electronics assembly is the idea that both active and passive devices can be moved from the surface of the printed wiring board to new locations inside the board itself. The concept has existed for decades, but is now being given new life by two ... Atmospheric Plasma Surface Cleaning for Advanced Nanotechnology Publication Date: 7/23/2008 By John Sniegowski, Ceiba Technologies and Dr. K.H. Lee, Plasma Systems & Materials One of the on-going challenges with ever shrinking feature sizes is to provide an effective yet economical cleaning solution that yields a properly treated surface that result in consistent and reliable adhesion and coating properties. There are numerous requirements for this in electronics ... Components Handling for Lean Electronic Publication Date: 6/10/2008 By Ed Romaine, Remstar International, Inc., Westbrook, ME Conventional rack, shelving and drawer systems used in electronic component manufacturing facilities are a "less than lean" method of storing these small, sensitive items. Locating and retrieving electronic components stored in these traditional systems wastes time, floor space, increases ... First Pass Success with Hi-Rel Circuits Publication Date: 6/10/2008 By Michael L. Martel, Contributing Editor Many electronics assemblers have turned to selective soldering as a replacement for wavesoldering of selected underside areas or through-hole components using pallets. There are a number of reasons for this: custom pallets are expensive, the wavesoldering process... How SMT Fasteners Solve Production Problems Publication Date: 6/10/2008 By Brian G. Bentrim, PennEngineering, Danboro, PA Traditional hardware options for assembling printed circuit boards have always carried potential baggage. The tedious and exacting process of handling and installing loose hardware often drains productivity. Broaching fasteners, while typically a more efficient alternative, can damage ... How Zemeter® Provides Integrated, Global Supply Chain Solutions Publication Date: 6/10/2008 By Gerard Groundwater, Vice President, Chief Information Officer, Anadigics, Warren, NJ and Harpal Singh PhD., CEO, Supply Chain Consultants, Wilmington, DE While broadband and wireless technologies have been around for more than 2 decades, they have significantly grown in complexity in the last few years. As the Internet and cable have become more and more widespread, people have also begun to expect faster and more reliable access. The ... Improving Inspection of Lead-Free Solder Publication Date: 10/1/2008 By Christian Munoz, Hirox USA Lead-free solders are said to cause various problems, such as: lack of self-alignment, bridges, solder balls, insufficient wetting, dendrites, pits, voids and peeling of soldering land. Also, on miniaturized lands, there may occur insufficient melting of solder paste. Even though these ... Lead-free Selective Soldering Equipment Publication Date: 10/1/2008 By Alan Cable, President, ACE Production Technologies Inc., Spokane Valley, WA Selective soldering is a flexible, adaptable process that is increasingly applied to an ever-widening range of soldering tasks. Indeed, selective soldering has moved beyond the role of being a problem application solution and into the soldering production mainstream. Flexible innovations ... Optimized Strategies to Reduce the Cost of Test and Inspection While Increasing Manufacturing Quality. Publication Date: 5/14/2009 Paul Groome, Machine Vision Products In the current economic environment optimizing manufacturing costs, and especially Test and Inspection costs are high on most companies agendas. But we still need to ensure the highest level of quality for customer shipments. Both cost and quality goals can be achieved by carefully selecting ... Shrinking Components, Highly Complex PCBs Drive AOI Design Publication Date: 10/1/2008 By Brian D'Amico, President, Mirtec Corp., Oxford, CT The continuing trend toward the miniaturization of electronic packaging technologies is perhaps the most prolific driving force behind new AOI product development. The advent of 0201 and 01005 packages and the industry-wide acceptance of BGA, CSP and a host of small outline ultra fine pitch ...