Friday, June 22, 2018
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Aegis Presents "MES Digitally Remastered"

Horsham, PA — Aegis Software is showcasing the latest release of its Industry 4.0, digitalized MES software, FactoryLogix, at SMT Hybrid Packaging. The company is also participating in the show-wide, live, IPC Connected Factory Exchange (CFX) Internet of Things (IoT) demo.
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Binder Adds 12-Pin M8 Connector with Gold-Plated Contacts

Camarillo, CA — Binder USA has added a 12-pin M8 connector to its 718 and 768 series M8 connectors. The 12 gold-plated contacts allow more data connections in a compact connector, making it easy to combine multiple connections into one connector to save panel space. The IP67-rated connectors are ...
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BTU Presents PYRAMAX and Profile Guardian

North Billerica, MA — BTU International is exhibiting its line of advanced thermal processing equipment for electronics manufacturing alongside its distributor EPP Electronic Production Partners GmbH at SMT Hybrid Packaging. The company is highlighting its Profile Guardian redundant process monitor and PYRAMAX ...
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CyberOptics: Applications for MRS-Enabled Inspection

Minneapolis, MN — CyberOptics® Corporation is demonstrating its MRS-enabled SQ3000 inspection system with multi-process capabilities, including 3D AOI, SPI and coordinate measurement at SMT Hybrid Packaging.
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Emil Otto Develops Activator System for Fluxes

Eltville, Germany — Flux gels are often used for rework on populated PCBs. In the past, fluxes for manual and repair soldering, which included other activators that were used for series production, often had to be used. Emil Otto's newly developed flux gels are based on uniform activators, which ...
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EVS Showcases Solder Recovery Systems

Isle of Wight, UK — EVS International is showcasing its enhanced EVS 500LFCab solder recovery system at SMT Hybrid Packaging. Last year, EVS developed a new addition of an integrated cabinet for the EVS500 to sit on. The addition of the cabinet combines an automated dross chute with a compartment ...
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Henkel: Non-Proprietary Solder Paste Analysis Toolkit

Irvine, CA — As device miniaturization and finer particle size solders become more mainstream, Henkel has developed a non-proprietary solder paste analysis toolkit to evaluate solder materials.
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HTV Presents Variety of Component Services

Bensheim, Germany — HTV Halbleiter-Test & Vertriebs is presenting a range of testing, programming, long-term conservation and storage, analytics, and processing of electronic components at SMT Hybrid Packaging.
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Indium Offers Reinforced Solder Preforms

Clinton, NY — Indium Corporation is now offering its InFORMS® solder preforms, which are composite preforms consisting of solder with a reinforced matrix. This combination is designed to increase lateral strength and improve bondline coplanarity, providing excellent thermal cycling reliability ...
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Inspectis Launches Tilt and Telescopic Table

Chester, CT — Complete and comprehensive precision inspection of parts and assemblies is easier and more precise when the objects under inspection can be inspected from various angles and heights, not only straight up and down.
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Instron Displays New Bluehill Testing Software

Norwood, MA — Built from the ground up for touch interaction, Bluehill® Universal is the next generation in materials testing software from Instron®. Maintaining all of the power and flexibility found in previous versions, Bluehill Universal introduces a wide range of new features designed to ...
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IPTE Offers PCB Routing and Handling Systems

Alpharetta, GA — IPTE Factory Automation is now offering a range of PCB depaneling and board handling systems. The EasyRouter is equipped with a milling tool that operates at speeds up to 2.4 in. (60 mm/s) for the fast routing of circuit boards from above. The depaneler is loaded manually during ...
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KIC Broadens Smart Factory Capabilities

San Diego, CA — KIC is "closing the loop" further with its KIC Eco-system. The company's Eco-system is a group of systems that work together to run production more effectively from NPI through to manufacturing, while gathering complete traceability data.
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KOA Speer Intros Surge Thick-Film Chip Resistors

Bradford, PA — KOA Speer Electronics has introduced its SG73G series of precision-surge, thick-film chip resistors. The series demonstrates a high pulse resistance and ultra precision with tolerances of ±0.25 and ±0.5 percent and a TCR of ±50 ppm/°C. SG73G resistors are available with ...
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Koh Young Supports Hermes Standard

Chandler, AZ — Koh Young Technology is supporting the Hermes Standard, and recently attended its third initiative meeting in Shanghai, China. The meeting included 31 SMT equipment suppliers, with 11 new participants, and focused on field testing, synergy with IPC CFC (Connected Factory Exchange) and further ...
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KYZEN Reveals Stencil Printing Research Findings

Nashville, TN — KYZEN is scheduled to release its latest research findings from controlled laboratory tests conducted to improve stencil printing reliability. The research will be shown at SMT Hybrid Packaging. The findings indicate consistently lower production yields are delivered when some of ...
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MAF Offers Component Packaging and Housing Services

Frankfurt, Germany — HTV subsidiary MAF Microelectronics Assembly Frankfurt is one of only a few European companies to offer electronic component packaging and housing services.
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Metcal Releases New Soldering Handpieces

Cypress, CA — Metcal is now offering its connection validation (CV) hand soldering system with a set of new handpieces, as well as a digital hot air pencil and solder tip cleaner. Connection validation is built on the same SmartHeat technology used in all Metcal soldering systems.
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MicroCare Highlights Flux Removal Pens

New Britain, CT — MicroCare is showcasing its latest electronics cleaning products at SMT Hybrid Packaging. These new circuit cleaners are designed to help companies boost quality, enhance throughput and lower PCB production costs. They also help clients meet increasingly strict European regulations ...
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MIRTEC Displays 3D AOI and Quality Management Software

Oxford, CT — MIRTEC Europe is displaying its lineup of 3D AOI systems, the MV-6 OMNI and MV-3 OMNI, as well as its total quality management system software, INTELLISYS, at SMT Hybrid Packaging.
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