Wednesday, July 26, 2017
VOLUME -23 NUMBER 6
Publication Date: 06/1/2008
Advertisements

Archive >  June 2008 Issue >  Front Page News > 
PolyFuel to demo methanol fuel cell laptop
Martin LaMonica, CNET

Martin LaMonica, CNET
PolyFuel, a company that develops fuel cell membranes, said Wednesday it has developed a prototype laptop--a Lenovo T40 ThinkPad--that uses methanol cartridges and a fuel cell as a power source. The company intends to show it off to consumer electronics and PC manufacturers...
Read More
Semiconductor sales may escape harsh economy's impact, Gartner says
Suzanne Deffree, Electronic News

Suzanne Deffree, Electronic News
Gartner Inc’s optimism toward the semiconductor market continues to grow, as the market research company today said the industry will record Q2 sales growth.
Read More
MIT Designs Solar Power Producing Windows, Coming Within 3 Years
Jason Mick, DailyTech

Jason Mick, DailyTech
There is much ongoing research into making photovoltaic solar power, common among commercial business and residential installations, more efficient.  While many focus on the cells themselves, MIT researchers are focusing on a different approach by changing the places where cells can be deployed and how light gets to them.
Read More
Amkor Unveils High-Performance Flip-Chip Packaging Technology
Sally Cole Johnson, Semiconductor International

Sally Cole Johnson, Semiconductor International
Responding to an industry shift toward thinner substrates to improve signal integrity and electrical performance, Amkor Technology Inc. (Chandler, Ariz.) has developed a flip-chip molded ball grid array (FCMBGA) that uses a molded underfill (MUF) rather than a capillary underfill (CUF) — enabling the much-coveted closer spacing between passives and the flip-chip die, better warpage control for thin-core substrates and improved solder joint reliability for passives.
Read More


 
 
LUTZE Introduces Teal Ethernet Cat5e Cable
CHARLOTTE, NC - Data transmission is critical for success in today’s manufacturing environment. LUTZE’s new flexible Cat5e AWM 600V Ethernet cable (part#104349) is engineered to protect your data from harmful interference ensuring uninterrupted data transmission and long term network reliability.
 

NXP Announces Production of Security Chips in its US Manufacturing Facilities
AUSTIN, TX; CHANDLER, AZ - NXP Semiconductors N.V. today announced a $22 million dollar program that expands its operations in the United States, enabling the Company’s US facilities to manufacture security chips for government applications that can support critical US national and homeland security programs.
 

SMTA International Technical Program Expands, Includes Research from HDPUG and AREA Consortium
MINNEAPOLIS, MN - SMTA announces an expanded program for the final day of the SMTA International Conference, September 17 - 21, 2017 in Rosemont, Illinois. In addition to the Lead-Free Symposium, the technical committee expanded the Thursday program to four concurrent tracks.
 

FOBA showcasing at the Fakuma – Laser marking on plastics
SELMSDORF - At the Fakuma, the international exhibition for plastics processing in Friedrichshafen/Germany (October 17-21, 2017), FOBA will be showcasing special marking solutions for different plastics. As an internationally leading manufacturer of laser marking systems, FOBA will be presenting product news about the M3000-UV for sensitive plastics and new marking solutions especially made for day-night-design.
 

 
search login