Sunday, October 22, 2017
VOLUME -23 NUMBER 6
Publication Date: 06/1/2008
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Archive >  June 2008 Issue >  Front Page News > 
PolyFuel to demo methanol fuel cell laptop
Martin LaMonica, CNET

Martin LaMonica, CNET
PolyFuel, a company that develops fuel cell membranes, said Wednesday it has developed a prototype laptop--a Lenovo T40 ThinkPad--that uses methanol cartridges and a fuel cell as a power source. The company intends to show it off to consumer electronics and PC manufacturers...
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Semiconductor sales may escape harsh economy's impact, Gartner says
Suzanne Deffree, Electronic News

Suzanne Deffree, Electronic News
Gartner Inc’s optimism toward the semiconductor market continues to grow, as the market research company today said the industry will record Q2 sales growth.
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MIT Designs Solar Power Producing Windows, Coming Within 3 Years
Jason Mick, DailyTech

Jason Mick, DailyTech
There is much ongoing research into making photovoltaic solar power, common among commercial business and residential installations, more efficient.  While many focus on the cells themselves, MIT researchers are focusing on a different approach by changing the places where cells can be deployed and how light gets to them.
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Amkor Unveils High-Performance Flip-Chip Packaging Technology
Sally Cole Johnson, Semiconductor International

Sally Cole Johnson, Semiconductor International
Responding to an industry shift toward thinner substrates to improve signal integrity and electrical performance, Amkor Technology Inc. (Chandler, Ariz.) has developed a flip-chip molded ball grid array (FCMBGA) that uses a molded underfill (MUF) rather than a capillary underfill (CUF) — enabling the much-coveted closer spacing between passives and the flip-chip die, better warpage control for thin-core substrates and improved solder joint reliability for passives.
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New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


Avnet Opens Registration for Global MiniZed SpeedWay Design Workshop Series: Training gives engineers head start in mastering design flows using Xilinx’s Vivado Design Suite
PHOENIX, AZ - Avnet, a leading global technology distributor, today announced that registration is now open for a series of interactive SpeedWay Design Workshops™ to help engineers jump start the development of single-core Xilinx® Zynq®-7000 All Programmable SoC devices using the Avnet MiniZed™ Zynq SoC development kit, a cost-optimized prototyping platform for embedded vision and Industrial IoT systems.
Coto Technology Awarded "Best of Show" (Silver) at Sensors Midwest 2017
ROSEMONT, IL - Coto Technology has been awarded Sensors Midwest's Best of Show "Silver" award for its newly-released RedRock TMR RR121 Magnetic Sensor. Seeking to replace aging magnetic sensor technology, the RR121 represents a huge breakthrough for design engineers seeking the lowest possible power consumption and highest sensitivity in an ultra-miniature package.
 
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