Friday, April 20, 2018
VOLUME -23 NUMBER 6
Publication Date: 06/1/2008
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Archive >  June 2008 Issue >  Front Page News > 
PolyFuel to demo methanol fuel cell laptop
Martin LaMonica, CNET

Martin LaMonica, CNET
PolyFuel, a company that develops fuel cell membranes, said Wednesday it has developed a prototype laptop--a Lenovo T40 ThinkPad--that uses methanol cartridges and a fuel cell as a power source. The company intends to show it off to consumer electronics and PC manufacturers...
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Semiconductor sales may escape harsh economy's impact, Gartner says
Suzanne Deffree, Electronic News

Suzanne Deffree, Electronic News
Gartner Inc’s optimism toward the semiconductor market continues to grow, as the market research company today said the industry will record Q2 sales growth.
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MIT Designs Solar Power Producing Windows, Coming Within 3 Years
Jason Mick, DailyTech

Jason Mick, DailyTech
There is much ongoing research into making photovoltaic solar power, common among commercial business and residential installations, more efficient.  While many focus on the cells themselves, MIT researchers are focusing on a different approach by changing the places where cells can be deployed and how light gets to them.
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Amkor Unveils High-Performance Flip-Chip Packaging Technology
Sally Cole Johnson, Semiconductor International

Sally Cole Johnson, Semiconductor International
Responding to an industry shift toward thinner substrates to improve signal integrity and electrical performance, Amkor Technology Inc. (Chandler, Ariz.) has developed a flip-chip molded ball grid array (FCMBGA) that uses a molded underfill (MUF) rather than a capillary underfill (CUF) — enabling the much-coveted closer spacing between passives and the flip-chip die, better warpage control for thin-core substrates and improved solder joint reliability for passives.
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SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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